Side Terminal Resistance-Reducing Layer for Display Bezel Reduction
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Solution Overview
Problem
Conventional display devices have a large bezel area due to the bonding method of the driving chip or flexible printed circuit board, which increases the peripheral area and can lead to resistance issues and oxidation, affecting the reliability and efficiency of the display.
Innovation Solution
A display device with a side terminal that includes a resistance-reducing layer made of a conductive material like aluminum and an upper conductive layer with higher oxidation resistance, such as silver or titanium, is used, allowing for a reduced bezel area and minimized resistance increase due to oxidation, by spacing the resistance-reducing layer apart from the connection pad and using a filling member to prevent impurities and oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the driving chip or flexible printed circuit board is bonded to the upper surface of the display panel substrate, then the connection is established, but the bezel area increases
Solution Approach 1:
The patent transitions from bonding the driving chip to the upper surface (2D plane) of the display panel to bonding it to the side surface (1D edge) of the panel. This dimensional change allows the connection to be made in a different spatial direction, thereby reducing the bezel area while maintaining connection reliability.
Solution Approach 2:
The side terminal is divided into multiple functional layers: a resistance-reducing layer (aluminum or copper) for low resistance connection, and an upper conductive layer (silver, titanium, nickel, or chrome) for oxidation resistance. This segmentation allows each layer to perform its specific function optimally, ensuring both low resistance and high reliability in the reduced bezel configuration.
Data Source
AI summary
A display device includes a pixel array disposed on a base substrate, a side terminal electrically connected to the pixel array, a connection pad including a first side surface contacting a side surface of the side terminal, and a driving device bonding to a second side surface of the connection pad, where the second side surface is opposite to the first side surface. The side terminal includes a resistance-reducing layer and an upper conductive layer, the resistance-reducing layer includes a first conductive material, the upper conductive layer is disposed on the resistance-reducing layer and includes a second conductive material having an oxidation resistance greater than the first conductive material. A portion of the upper conductive layer is disposed between the connection pad and the resistance-reducing layer such that the resistance-reducing layer is spaced apart from the connection pad.