Oblique Pick Up Plug for Image Sensor Electron Dissipation
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Solution Overview
Problem
Scaling down semiconductor image sensors to achieve smaller size and higher resolution results in increased electric resistance due to smaller p-type isolations, compromising device performance.
Innovation Solution
A novel semiconductor structure with an obliquely disposed pick up plug in the isolation region provides an alternative conductive path for electron dissipation, allowing for smaller pixel and isolation sizes while maintaining device performance by grounding the pick up plug and using a conductive material like W for efficient electron dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the p-type isolation size is scaled down to reduce image sensor size, then the device size is reduced, but the electric resistance of the p-type isolation increases
Solution Approach 1:
The invention introduces a vertical conductive path by forming a pick-up plug that extends from the first conductivity type region through the substrate to a ground electrode. This third-dimensional approach provides an additional electron dissipation route that compensates for the increased horizontal resistance caused by scaled-down p-type isolations, thereby resolving the contradiction between miniaturization and electrical performance
Solution Approach 2:
The pick-up plug acts as an intermediary conductive element that bridges the first conductivity type region and the ground electrode. This intermediate structure provides a low-resistance pathway for electron dissipation, effectively mediating between the scaled-down isolation structures and the ground reference to maintain overall device performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient electron dissipation and improved device performance by reducing electric resistance and aligning with stricter design rules, allowing for smaller, higher-resolution image sensors.
Implementation Method 1
the pick up plug is grounded to enable an upward conductive path to dissipate electrons coming from the pixel regions other than via the substrate
Implementation Method 2
an alternative conductive path to dissipate electrons
Data Source
AI summary
An image sensor includes a substrate, multiple pixel regions separately disposed in the substrate, and a pick up region including a doping region and a pick up plug obliquely disposed on the doping region and directly contacting the doping region.