Silicone Resin Cutting via Scribe and Push-Split for LED Arrays

Solution Overview

Problem

The challenge lies in efficiently producing light emitting devices using silicone-based resins, as they are difficult to cut with rotary blades due to high rubber elasticity, complicating simultaneous cutting with ceramic wiring boards.

Innovation Solution

A method involving a collective substrate with a ceramic base member, where a silicone-based resin covering member surrounds light emitting elements, and a cut is made with a non-rotating blade to allow for push-splitting, reducing tool wear and facilitating mass production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a rotary blade is used to cut the silicone-based resin covering member, then the cutting process can be simple and fast, but the tool wear increases significantly and the resin is difficult to cut due to high rubber elasticity

Engineering Contradiction:

Improvecutting speedVSAvoidtool wear

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The cutting process is divided into two distinct stages: first, a scribe line is formed on the lower surface of the collective substrate to create a separation path; second, a push-splitting operation separates the individual light emitting devices along the scribe line. This segmentation allows each operation to be optimized independently, avoiding the need for a single cutting tool to handle both the substrate and resin simultaneously.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of cutting from the upper surface where the resin is located, the scribe line is formed from the lower surface of the collective substrate. This inverted approach allows the blade to cut the hard ceramic substrate first, then the push-splitting operation naturally separates the resin without requiring it to be cut by a rotary blade, thus reducing tool wear while maintaining productivity.

Inventive Principle:

Principle #13The other way round (Inversion)

2Device complexity

If simultaneous cutting of both the resin and ceramic wiring board is attempted, then one process can be completed, but the process becomes complicated due to the different material properties

Engineering Contradiction:

Improvecutting process complexityVSAvoidmass production efficiency

Core Design Contradiction:

Device complexityVSProductivity

Solution Approach 1:

The cutting process is divided into two distinct stages: first, a scribe line is formed on the lower surface of the collective substrate to create a separation path; second, a push-splitting operation separates the individual light emitting devices along the scribe line. This segmentation allows each operation to be optimized independently, avoiding the need for a single cutting tool to handle both the substrate and resin simultaneously.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The scribe line acts as an intermediary structure that facilitates the separation process. By pre-forming this line on the lower surface, the subsequent push-splitting operation can proceed smoothly without requiring complex simultaneous cutting mechanisms, thus simplifying the overall process while maintaining high productivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If a non-rotating blade is used for push-splitting, then tool wear is reduced and mass production efficiency is improved, but additional process steps are required compared to simple rotary cutting

Engineering Contradiction:

Improvetool wear reductionVSAvoidnumber of process steps

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The cutting process is divided into two distinct stages: first, a scribe line is formed on the lower surface of the collective substrate to create a separation path; second, a push-splitting operation separates the individual light emitting devices along the scribe line. This segmentation allows each operation to be optimized independently, avoiding the need for a single cutting tool to handle both the substrate and resin simultaneously.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The scribe line is formed in advance on the lower surface of the collective substrate before the push-splitting operation. This preliminary action creates a predetermined separation path that guides the subsequent splitting process, making the overall operation more efficient despite the additional step, as it eliminates the need for complex real-time control during splitting.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS9755105B2Method for producing light emitting device

Publication Date: 2017.09.05 NICHIA CORP

AI summary

A method for producing a light emitting device includes providing a light emitting device array including a collective substrate, a plurality of light emitting elements, a covering member covering a region surrounding the plurality of light emitting elements, in which the plurality of light emitting elements and the covering member are arranged on an upper surface of the collective substrate, the collective substrate including a ceramic base member, and the covering member containing a silicone-based resin as a base material; making a cut into the covering member such that the cut has a depth such that an uncut portion remains in the covering member in a direction of the depth' and push-splitting the collective substrate, and splitting the uncut portion of the covering member after the making the cut into the covering member.