Chip Transfer Assembly with Colloid Protrusions for Micro-LED Integration
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Solution Overview
Problem
The manufacturing process of Micro-LED display panels is tedious and inefficient, leading to high costs due to the need to separately transfer blue LED chips to a display backplane and then manufacture luminescent conversion films, which complicates the process and increases expenses.
Innovation Solution
A chip transfer assembly with a porous adhesive layer and colloid protrusions that accommodate luminescent conversion particles, allowing for simultaneous transfer and soldering of LED chips to the display backplane, eliminating the need for a separate luminescent conversion film manufacturing step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the blue LED chip is first transferred to the display backplane and then luminescent conversion films are separately manufactured, then the LED chip can be precisely positioned and soldered, but the manufacturing process becomes tedious and efficiency decreases
Solution Approach 1:
The patent combines the LED chip transfer process with the luminescent conversion film formation process into a single integrated operation. The transfer substrate simultaneously carries both the LED chips and the luminescent conversion particles, allowing both components to be transferred and positioned together on the display backplane in one step, thereby eliminating the need for separate film manufacturing steps while maintaining precise positioning.
Solution Approach 2:
The luminescent conversion particles are pre-loaded onto the transfer substrate along with the LED chips before the transfer process. This preliminary preparation allows the conversion films to be in place and ready for immediate use once the chips are transferred and soldered, eliminating post-transfer film manufacturing steps and improving overall manufacturing efficiency.
2Manufacturing precision
If separate luminescent conversion film manufacturing is performed after chip transfer, then the conversion layer can be precisely aligned, but the manufacturing cost increases
Solution Approach 1:
The transfer substrate integrates both LED chip carrying areas and luminescent conversion particle carrying areas, enabling simultaneous transfer of both components. This merging of functions reduces the number of separate manufacturing steps and material handling operations, thereby lowering manufacturing costs while maintaining precise alignment through the unified transfer process.
3Ease of manufacture
If multiple separate steps are used for chip transfer and film manufacturing, then each step can be optimized independently, but the manufacturing cycle lengthens
Solution Approach 1:
The patent merges the chip transfer and film formation operations into a single integrated transfer step. The transfer substrate is designed with both chips and conversion particles loaded in their respective positions, allowing both to be transferred and positioned simultaneously on the display backplane. This eliminates intermediate steps and reduces manufacturing cycle time while maintaining process optimization capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, enhances efficiency, and reduces costs by integrating the transfer and luminescent conversion processes, thereby shortening the manufacturing cycle and lowering production expenses.
Implementation Method 1
a porous adhesive layer, in which a plurality of first pores are distributed, is formed on the transfer substrate. At least one colloid protrusion... in which a plurality of second pores are distributed... The second pore is configured to accommodate the luminescent conversion particle during transfer of a Light-Emitting Diode (LED) chip
Implementation Method 2
The colloid protrusion is configured to be attached to a light-emitting surface of a to-be-transferred LED chip and then to adsorb the LED chip under the action of cooling after heating during transfer of the LED chip
Data Source
AI summary
A chip transfer assembly and a manufacturing method therefor, a chip transfer method, and a display backplane. The chip transfer assembly comprises a transfer substrate (1); a porous adhesive layer (2) formed on the transfer substrate, first pores (21) being distributed in the porous adhesive layer; and at least one colloid protrusions (3) formed on the porous adhesive layer, the colloid protrusions having light transmittance, and second pores (31) used for accommodating luminescent conversion particles (4) being distributed in the colloid protrusions; after an LED chip (7) is transferred to a chip soldering zone, the colloid protrusions separate from the porous adhesive layer and remain on the LED chip to form a luminescent conversion layer.