Chip Transfer via Laser Heating and Pressure on Thin Foil
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Solution Overview
Problem
The existing methods for contacting chips on substrates require significant handling effort and result in lengthy process times due to the need for precise alignment of chip contacts with substrate contacts, which increases equipment requirements and processing steps.
Innovation Solution
A device and method utilizing a transfer substrate, such as a thin foil, to align and position chips, allowing for mechanical and thermal stress application to establish contact, reducing handling effort and enabling rapid thermal and mechanical connections between chip and substrate contacts through adhesive or soldering processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If direct handling of chips is used for positioning and contacting, then precise alignment of chip contacts with substrate contacts can be achieved, but handling effort and process time increase significantly
Solution Approach 1:
The chip is pre-positioned on the transfer substrate with defined alignment marks before the contacting process. This preliminary positioning eliminates the need for time-consuming alignment operations during the actual contacting step, as the chip's relative position is already established through the alignment mark system
Solution Approach 2:
The transfer substrate acts as an intermediary carrier that holds the chip in a pre-positioned state. This intermediary enables the chip to be transferred to the contact substrate without requiring direct handling and alignment operations, thus reducing both handling effort and process time while maintaining alignment precision
2Measurement precision
If direct handling of chips is used for positioning, then alignment can be achieved, but equipment complexity and handling effort increase
Solution Approach 1:
The transfer substrate with pre-defined alignment marks serves as an intermediary that simplifies the equipment requirements. Instead of complex alignment mechanisms, the system uses the alignment mark system on the transfer substrate to guide positioning, reducing equipment complexity while maintaining alignment precision
Solution Approach 2:
The alignment marks on the transfer substrate create a reproducible reference system that can be copied or referenced during the contacting process. This copying approach eliminates the need for complex real-time alignment measurements and positioning equipment
3Strength
If thick transfer substrates are used, then mechanical stability is improved, but thermal resistance increases and contacting time extends
Solution Approach 1:
The patent employs a thin foil as the transfer substrate, which provides sufficient mechanical stability for chip carrying while minimizing thermal resistance. The thin film structure allows rapid heat transfer from the contact substrate through the transfer substrate to the chip, enabling fast thermal contacting processes without compromising mechanical support
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces handling effort and shortens contacting times, enabling efficient production of multiple chip-substrate connections in a short time, particularly suitable for large-scale component groups like transponders, by using a transfer tool with a laser device and pressure device for precise alignment and bonding.
Implementation Method 1
laser energy is applied... through which laser energy is applied and the chip is brought into contact
Implementation Method 2
the chip is brought into contact with its chip contacts arranged opposite a contact surface of the contact substrate through the transfer substrate at the rear by means of a pressure device
Implementation Method 3
the adhesive connection of the chip to the transfer substrate is released... the adhesive application is particularly suitable that can be set exactly to the desired detachment temperature
Data Source
AI summary
The invention relates to a method and device for transferring a chip (18), which is arranged on a transfer substrate (26), to a contact substrate (50) and for contacting the chip to the contact substrate, during which the chip, which is adhesively attached via its rear side (19) to a holding surface of the transfer substrate, said holding surface facing the contact substrate. The rear side of the chip is subjected to the action of laser energy passing through the transfer substrate, and a pressing device (45, 46) acting upon the rear of the chip and through the transfer substrate brings the chip, via its chip contacts (59, 60) located opposite a contact surface (58) of the contact substrate, into contact with substrate contacts (56, 57) located on the contact surface, and a thermal connection is established between the chip contacts and the substrate contacts.