Chip-Type Electric Double Layer Capacitor with Buried External Terminals
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Solution Overview
Problem
Conventional electric double layer capacitors have a large thickness due to additional structures required for surface mounting, which limits their use in high-capacity products and increases manufacturing costs.
Innovation Solution
A chip-type electric double layer capacitor design with an exterior case made of insulation resin, featuring buried external terminals and adhesive layers to prevent electrolyte leakage, allowing for surface mounting without additional structures and reducing size and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If brackets are added for surface mounting, then the electric double layer capacitor can be mounted on circuit board, but the thickness increases
Solution Approach 1:
The patent merges the mounting function directly into the capacitor body by forming external terminals that protrude from the case in a direction perpendicular to the stacked electrodes. This integration eliminates the need for separate brackets, allowing the capacitor to be surface-mounted directly while maintaining reduced thickness.
2Ease of operation
If brackets are added for surface mounting, then the electric double layer capacitor can be mounted on circuit board, but the manufacturing cost increases
Solution Approach 1:
The mounting function is merged into the capacitor body through integrated external terminals, eliminating the need for separate bracket components and their associated manufacturing and assembly processes, thereby reducing manufacturing cost.
Solution Approach 2:
The patent extracts the mounting function from separate bracket components and incorporates it directly into the capacitor structure through the external terminals, simplifying the overall structure and reducing component count.
3Ease of operation
If additional structures are added for surface mounting, then the capacitor can be mounted on circuit board, but the device complexity increases
Solution Approach 1:
The external terminals are formed as an integral part of the case through injection molding, merging the mounting structure with the capacitor body. This integration reduces device complexity by eliminating separate mounting components and simplifying the overall structure.
Data Source
AI summary
A method of manufacturing a chip-type electric double layer capacitor, including: forming a lower case having an opened housing space and first and second external terminals buried therein, the first and second external terminals having first surfaces exposed to the housing space, respectively, and second surfaces exposed to an outer region of the lower case, respectively; mounting an electric double layer capacitor cell in the housing space such that the electric double layer capacitor cell is electrically connected to the first surfaces of the first and second external terminals exposed to the housing space; and mounting an upper cap on the lower case so as to cover the housing space.