Capacitor Terminals TRIZ Cases

A conductive substrate and stacked dielectric layers raise capacitance without enlarging footprint or relying on MOS substrate limits.

A recessed lid and conductive member clamp the current collector end part, improving sealing and constraint reliability in power storage cells.

A stacked dielectric-conductor capacitor raises capacitance while easing substrate and process constraints through insulated conductive layers.

Gas release grooves in auxiliary terminals vent flux during soldering, reducing voids, cracks, and solder balls while improving inspection.

A recessed SMD base with conductive tab simplifies lead-wire coupling, improves vibration resistance, and supports compact wet capacitor mounting.

Independent auxiliary terminals and wider groove spacing suppress seating plate warpage and improve solder joint strength.

Blasted press dies create random micro-texture on lead terminals during flattening, reducing burrs and short-circuit risk in electronic components.

Circumferential protrusions and section-specific coatings enable laser welding while protecting epoxy insulation, sealing, and contact stability.

A locking sealing member restrains electrode terminal lift under vibration, reducing seal breakage and terminal detachment.

A locking seal covers the terminal edge to stop lift under vibration, preventing resin breakage and terminal detachment.

Laser ablation forms uniformly spaced anode-foil tunnels, raising capacitance and energy density while reducing resistance in electrolytic capacitors.

Intermittent slurry coating creates a foil-exposed lead area that avoids active-layer detachment, lowers contact resistance, and improves device performance.

Laser ablation creates uniform hexagonal tunnel arrays in anode foils, boosting electrolytic capacitor capacitance and energy density.

A standardized bioflavonoid blend modulates HMGB1 and NF-κB signaling to curb oxidative stress, inflammation, and immune senescence.

A larger through-hole end on the sealing side disperses pressure, reducing conductor breakage while preserving capacitor capacity.

A split foil-and-rod lead structure shortens the internal path to cut ESR while avoiding sealing plate interference.

Directly fixing capacitor terminals to the busbar and conductive support cuts parasitic inductance and impedance for better noise filtering.

Interleaved insulating members and extended sheets let a capacitor header discharge quickly while resisting dielectric breakdown and surface tracking.

Gas-release grooves and side auxiliary terminals vent flux gas, suppress voids and cracks, and make solder quality visible during mounting.

A narrow-wide projection on the seating plate expands support area to suppress warpage and maintain solder joint strength in compact electrolytic capacitors.

A flat stacked aluminium electrolytic snubber capacitor improves cooling, lowers parasitic inductance, and absorbs voltage spikes in power modules.

A threaded wedge clamp secures cylindrical capacitors of different lengths and minor diameter variations with consistent fastening force.

A single asymmetrical capacitor shape enables offset stacking with rounded outer surfaces, saving implant space and improving under-skin comfort.

Through-anode tunnels improve electrolyte flow, enabling thicker fused-particle layers to raise capacitance while maintaining high delivered energy.

Protection tape bonded to the exposed current collector beside the lead terminal improves cell shock resistance without sacrificing capacity.

Interleaved non-planar insulators and extended sheets lengthen the insulation path, enabling rapid high-voltage discharge with lower breakdown risk.

Through-tunnels in the current collector improve electrolyte flow, raising capacitance in thick anodes while preserving high DSR.

Dual-density pressing distorts the anode wire in a dense region to improve pull strength while preserving capacitor surface area and capacitance.

A pedestal-side gap absorbs sealing-member expansion during solder reflow, preventing capacitor detachment and weak board connections.

Laser welding replaces destructive resistance welding in stacked aluminum electrolytic capacitors, preserving anode volume and low impedance.

A horizontal electrolytic capacitor module cuts wasted PCB mounting space, lowers profile, and preserves simple pad connections.

A gap-controlled laser weld raises joint strength while limiting heat impact on base materials and nearby members in compact assemblies.

A resin-filled seal with surface protrusions blocks air and moisture, limiting oxidation, voids, and leakage current in electrolytic capacitors.

Chamfered lead-out corners spread stress at the exterior-body interface, suppressing cracks and improving capacitor sealability.

A ripple current generating circuit uses an isolated light-emitting diode to signal capacitor failure conditions.

Patterned grooves in the cover and plate ensure precise alignment of the material stack, improving reliability while maintaining packaging efficiency.

Capacitor module with isolated positive and negative terminals reduces vibration and extends lifespan through effective thermal management.

Angled terminals and a central divider electrically isolate capacitor assemblies, improving cooling efficiency and reducing vibration in EV inverter modules.

Electrolytic reduction of tantalate precursors using a sacrificial non-carbon anode in molten salt to produce metallic tantalum powder.

Separator protrusions engage electrode recesses to enable self-alignment, preserving surface area and preventing gas-rich electrolyte starvation.