Horizontal Capacitor Module Layout for Compact PCB Mounting

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Solution Overview

Problem

Conventional electrolytic capacitors mounted vertically on printed circuit boards (PCBs) lead to significant wasted mounting space, limiting the integration density and increasing the physical size of electronic devices due to their size and orientation.

Innovation Solution

Horizontally mounting electrolytic capacitors on PCBs using a case with electrode pads and a frame that surrounds the capacitor, allowing for reduced vertical space occupation and improved integration density through automated manufacturing processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If electrolytic capacitors are mounted vertically on PCBs, then the mounting process is simple and straightforward, but the vertical space occupation increases significantly, reducing integration density

Engineering Contradiction:
Improvemounting simplicityVSAvoidvertical space occupation
Core Design Contradiction:
Ease of manufactureVSVolume of moving object

Solution Approach 1:

The patent transitions the capacitor mounting orientation from vertical to horizontal, changing the dimension in which the capacitor occupies space. By mounting the capacitor horizontally on the PCB surface, the vertical profile is minimized while the horizontal footprint is optimized, effectively resolving the contradiction between mounting simplicity and vertical space occupation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If electrolytic capacitors are mounted vertically on PCBs, then the electrical connections are straightforward, but the overall device size increases due to wasted mounting space

Engineering Contradiction:
Improveconnection simplicityVSAvoiddevice size
Core Design Contradiction:
Ease of manufactureVSVolume of stationary object

Solution Approach 1:

The patent changes the mounting dimension from vertical to horizontal, allowing the capacitor to be positioned within the PCB's planar area rather than extending vertically. This dimensional change reduces the overall device volume while maintaining electrical connection simplicity through the electrode pad configuration.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Device complexity

If conventional vertical mounting is used, then the capacitor structure is simple, but the integration density is limited due to size constraints

Engineering Contradiction:
Improvecapacitor structureVSAvoidintegration density
Core Design Contradiction:
Device complexityVSArea of moving object

Solution Approach 1:

The patent resolves the contradiction by changing the mounting orientation from vertical to horizontal, which optimizes the use of available PCB area. This dimensional change allows for better space utilization and improved integration density while maintaining a relatively simple capacitor structure with electrode pads configured for horizontal mounting.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11856700B2Horizontally mounted capacitor module and electronic device including same
Publication Date: 2023.12.26 SAMSUNG ELECTRONICS CO LTD
  • US11856700B2 patent drawing
  • US11856700B2 patent drawing
  • US11856700B2 patent drawing

AI summary

A capacitor module horizontally mounted on a PCB and including a case including a first side surface, an opposing second side, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface, and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from second electrode pad in a second horizontal direction.