Embedded Capacitor Substrate With Stepped Through-Hole Conductors

Solution Overview

Problem

Existing capacitor embedded substrates face issues with breakage of through conductors and conductor wiring layers at their end portions, as well as a decrease in electrostatic capacity due to increased diameter of through-hole conductors.

Innovation Solution

A capacitor embedded substrate design that includes a core substrate with a base defining an opening, a capacitor component with a positive electrode layer, dielectric layer, and negative electrode layer, and a sealing member that covers the core substrate and capacitor component. The capacitor component features a through conductor on its inner-wall surface and a conductor wiring layer on its end portions, with a specific diameter configuration of the through-hole end portions to disperse pressure and maintain electrostatic capacity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the diameter of the first through-hole conductor is increased to disperse pressure, then the breakage of the through conductor is suppressed, but the area of the second base decreases and the electrostatic capacity decreases

Engineering Contradiction:

Improvebreakage resistance of through conductorVSAvoidelectrostatic capacity

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

The through-hole conductor has different diameters at different locations: a larger first diameter at the supporting plate side for pressure dispersion and a smaller second diameter at the capacitor component side for maintaining electrostatic capacity. This local variation in diameter allows each section to fulfill its specific functional requirement.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The through-hole conductor is divided into multiple sections with different diameters along its length. The first section (first through-hole conductor) has a larger diameter for mechanical strength, while the second section (second through-hole conductor) has a smaller diameter for electrical performance, creating a segmented structure that addresses both requirements.

Inventive Principle:

Principle #1Segmentation

2Reliability

If the diameter of the first through-hole conductor is increased to disperse pressure, then the breakage of the conductor wiring layer is suppressed, but the area of the second base decreases and the electrostatic capacity decreases

Engineering Contradiction:

Improvebreakage resistance of conductor wiring layerVSAvoidelectrostatic capacity

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

The through-hole conductor has different diameters at different locations: a larger first diameter at the supporting plate side for pressure dispersion and a smaller second diameter at the capacitor component side for maintaining electrostatic capacity. This local variation in diameter allows each section to fulfill its specific functional requirement.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The through-hole conductor is divided into multiple sections with different diameters along its length. The first section (first through-hole conductor) has a larger diameter for mechanical strength, while the second section (second through-hole conductor) has a smaller diameter for electrical performance, creating a segmented structure that addresses both requirements.

Inventive Principle:

Principle #1Segmentation

3Ease of manufacture

If the via conductor structure is placed on a supporting plate, then the positioning is facilitated, but the pressure at the time of placing causes breakage in the first through-hole conductor

Engineering Contradiction:

Improvepositioning of via conductor structureVSAvoidintegrity of through conductor

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The through-hole conductor has different diameters at different locations: a larger first diameter at the supporting plate side for pressure dispersion and a smaller second diameter at the capacitor component side for maintaining electrostatic capacity. This local variation in diameter allows each section to fulfill its specific functional requirement.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250174397A1Capacitor embedded substrate

Publication Date: 2025.05.29 MURATA MFG CO LTD

AI summary

A capacitor embedded substrate that includes: a core substrate that includes a base that defines an opening in a thickness direction; a capacitor component in the opening of the core substrate; and a sealing member sealing the core substrate and the capacitor component, wherein the capacitor component includes a capacitor main body, a through conductor in a through-hole penetrating the capacitor main body in the thickness direction, and a conductor wiring layer on opposed end portions of the through conductor in the thickness direction, a first surface of the core substrate and a first surface of the capacitor component exist on a same plane, and a diameter of an end portion of the through-hole on a first sealing portion side is larger than a diameter of an end portion of the through-hole on a second sealing portion side.