Chip Wiring Layer Temperature Sensing Circuit
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Solution Overview
Problem
Existing chip cooling methods primarily measure substrate temperature, failing to accurately reflect the temperature of the middle and top routing metal layers, leading to nonlinear thermal gradients and signal transmission delays, especially in high-speed applications, and making it difficult to measure temperature gradients effectively.
Innovation Solution
A chip wiring layer temperature sensing circuit with a metal wiring layer temperature detection module, pulse delay detection module, and temperature transition module, which uses a system high-speed clock to detect delay data and calculate the temperature of the metal wiring layer, allowing for temperature monitoring at various layers of the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If substrate temperature measurement is used, then temperature monitoring is simple, but it cannot reflect the actual temperature of the middle layer and top routing metal
Solution Approach 1:
The patent uses delay data as an intermediary to indirectly measure the temperature of the metal wiring layer. Instead of directly measuring temperature, the system measures the delay of a test signal passing through the metal interconnection structure, which changes with temperature. This intermediary measurement approach allows accurate temperature monitoring without direct thermal contact or complex thermocouple installations.
Solution Approach 2:
The patent replaces traditional mechanical/thermal temperature sensing methods (such as thermocouples or thermal sensors) with an electrical measurement approach. By measuring the electrical signal delay through the metal interconnection structure, the system substitutes mechanical thermal contact with an electrical field-based measurement, achieving non-invasive temperature monitoring of the wiring layer.
2Loss of energy
If heat sinks are arranged at the top of the chip, then heat dissipation is improved, but a nonlinear thermal gradient is formed on the chip
Solution Approach 1:
The patent divides the temperature monitoring function into multiple segments by placing temperature sensing capabilities at different locations within the chip. By using multiple metal interconnection structures at different positions and layers, the system segments the temperature measurement function, allowing independent monitoring of temperature variations at each location, thereby characterizing the thermal gradient distribution.
Solution Approach 2:
The patent transitions from single-point temperature measurement to multi-dimensional temperature characterization by incorporating measurements from multiple metal wiring layers and multiple locations. This dimensional expansion allows the system to map the three-dimensional thermal gradient distribution within the chip, providing comprehensive thermal awareness rather than a single temperature value.
3Loss of energy
If the temperature of the routing metal increases, then heat dissipation is enhanced, but signal transmission delay is greatly increased
Solution Approach 1:
The patent implements a feedback mechanism where the measured delay data is used to infer temperature conditions, and this temperature information can be used to adjust operating parameters or trigger cooling actions. The system continuously monitors delay changes and uses this feedback to maintain optimal signal transmission performance by compensating for temperature-induced delay variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate temperature monitoring of the metal wiring layers, reducing signal transmission delays and improving performance by detecting temperature changes across different layers, thereby addressing the limitations of prior art in measuring chip temperatures.
Implementation Method 1
the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data
Data Source
AI summary
This invention discloses a chip wiring layer temperature sensing circuit, a temperature sensing method, a chip stereo temperature sensor, and a chip thereof. The chip wiring layer temperature sensing circuit includes a metal wiring layer temperature detection module, a pulse delay detection module, and a temperature transition module; wherein the metal wiring layer temperature detection module is disposed at a metal interconnection structure of a metal wiring layer of a chip; and the metal interconnection structure is electrically connected to the pulse delay detection module; wherein the pulse delay detection module includes a system high-speed clock, a delay data generated after a pulse passing through the metal wiring layer temperature detection module detected by the system high-speed clock, and the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data.