Chiplet Clock Mesh Synchronization Across Dies
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Solution Overview
Problem
Conventional chiplet technologies face significant clock delays and high power consumption due to clock asynchronization between dies, limiting the performance and efficiency of multi-die systems.
Innovation Solution
The implementation of synchronized clock meshes and circuits within a chiplet, utilizing symmetrical drive buffer structures and phase-locked loops, along with silicon interposers to unify clock domains and reduce power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional die-to-die interconnection is used with separate clock generation circuits on each die, then each die can operate independently, but large clock delay and clock asynchronization occur between dies
Solution Approach 1:
The patent merges the clock generation function into a single centralized clock generation circuit located on one die, which then distributes synchronized clock signals to all other dies in the module. This eliminates the need for separate clock generation circuits on each die and ensures uniform clock timing across all dies, resolving the clock asynchronization and delay issues.
Solution Approach 2:
The patent introduces a dedicated clock distribution network as an intermediary between the centralized clock generation circuit and the various dies. This intermediary structure provides a standardized interface for clock signal distribution, ensuring synchronized clock delivery to all dies without direct point-to-point connections, thereby reducing clock delay and improving synchronization reliability.
2Use of energy by stationary object
If separate clock generation circuits are used on each die, then each die has clock independence, but interconnection power consumption increases
Solution Approach 1:
The patent consolidates multiple distributed clock generation circuits into a single centralized clock generation circuit. This merging reduces the total number of clock generation components across the module, thereby reducing interconnection power consumption and simplifying the overall clock circuit configuration while maintaining clock independence through proper distribution design.
3Ease of manufacture
If multiple clock domains are used across different dies, then each die can be optimized independently, but clock domain crossing complexity increases
Solution Approach 1:
The patent introduces a standardized clock distribution network as an intermediary that provides unified clock signals to all dies. This intermediary structure eliminates the need for complex clock domain crossing mechanisms by ensuring all dies operate from the same clock domain, thereby reducing clock domain management complexity while still allowing independent die optimization through the standardized interface.
Data Source
AI summary
An example chiplet includes a first die, a second die, a first clock mesh, and a second clock mesh. A first clock circuit in the first die includes a first clock generation circuit and a first drive buffer circuit. A second clock circuit in the second die includes a second drive buffer circuit. An input end of the first drive buffer circuit is coupled to a first output end of the first clock generation circuit, and a first output end of the first drive buffer circuit is coupled to an input end of the first clock mesh. An input end of the second drive buffer circuit is coupled to a second output end of the first clock generation circuit, and a first output end of the second drive buffer circuit is coupled to an input end of the second clock mesh.