Chiplet Head X-Ray Alignment for TSV Bonding Precision
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Solution Overview
Problem
Existing semiconductor chip bonding methods, particularly optical alignment techniques, face challenges in achieving high precision and yield due to limitations in identifying bonding locations and preventing damage to semiconductor chips, especially with the miniaturization and increased number of bonding parts.
Innovation Solution
A semiconductor packaging alignment apparatus utilizing an X-ray imaging system for precise alignment, which includes a radiation source, head, and sensor to detect and align semiconductor chips based on TSVs and alignment marks, reducing damage by targeting radiation only to specific areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If optical alignment method is used for chip bonding, then the alignment process can be performed with existing technology, but the bonding precision is insufficient for miniaturized interconnects and TSVs
Solution Approach 1:
The patent replaces the optical alignment system with an X-ray imaging system. The X-ray source and detector are integrated into the chiplet head to provide high-precision imaging of alignment marks and TSVs, enabling accurate alignment that optical methods cannot achieve for miniaturized features.
Solution Approach 2:
The chiplet head is designed to perform multiple functions: it serves as both the bonding tool and the imaging system. The X-ray source, collimator, and detector are integrated into the chiplet head structure, allowing it to both position chips and verify alignment through imaging.
2Measurement precision
If X-ray radiation is applied to entire chip area for alignment, then complete imaging of alignment marks and TSVs is achieved, but semiconductor chips suffer from radiation damage
Solution Approach 1:
The patent uses a collimator to restrict X-ray radiation to only the specific areas where alignment marks and TSVs are located. This localized radiation approach provides sufficient imaging quality for alignment while minimizing radiation exposure to the rest of the chip, thereby reducing radiation damage.
Solution Approach 2:
Instead of radiating the entire chip area, the system applies X-ray radiation partially only to the necessary regions containing alignment features. This partial action achieves the required measurement precision while avoiding excessive radiation that would cause damage.
3Device complexity
If optical alignment system is located outside chiplet head, then the chiplet head structure remains simple, but the alignment mark area on lower chip increases reducing integration
Solution Approach 1:
The patent merges the imaging system with the chiplet head by integrating the X-ray source, collimator, and detector directly into the head structure. This eliminates the need for separate external optical alignment systems and reduces the alignment mark area required on the lower chip, thereby improving integration.
4Quantity of substance
If number of bonding parts per area is increased for higher capacity, then chip functionality is enhanced, but alignment precision becomes more difficult to achieve
Solution Approach 1:
The patent replaces optical alignment with X-ray imaging to achieve the higher precision required for increased numbers of bonding parts. The X-ray system can resolve finer features and provide more accurate positioning even as the density of bonding parts increases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances bonding accuracy, increases production yield, reduces production costs, and improves price competitiveness by minimizing alignment errors and protecting semiconductor chips from unnecessary radiation exposure.
Implementation Method 1
a radiation source that radiates radiation to a plurality of semiconductor chips
Implementation Method 2
a radiation sensor that detects the radiation passing through the plurality of semiconductor chips
Data Source
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Figure 3A
AI summary
The present disclosure relates to a semiconductor packaging alignment apparatus (100) and a method thereof, and the semiconductor packaging alignment apparatus includes a radiation source (120) that radiates radiation to a plurality of semiconductor chips, a radiation sensor (140) that detects the radiation passing through the plurality of semiconductor chips, a head (130) that is coupled with one of the radiation source or the radiation sensor, an alignment part (150) that aligns and bonds the plurality of semiconductor chips based on detection information acquired by the radiation sensor, and a process that controls at least one of the radiation source, the head, the radiation sensor, or the alignment part, or any combination thereof, wherein the processor (110) identifies a second semiconductor chip, which is to be coupled to a first semiconductor chip, among the plurality of semiconductor chips, based on identification of the first semiconductor chip, which is coupled to at least a portion of the head, among the plurality of semiconductor chips and controls at least one of the head, or the alignment part, or any combination thereof to match a first reference mark included in the first semiconductor chip and a second reference mark included in the second semiconductor chip.