Embedding Chipset Interposer in Wafer Substrate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional fabrication techniques for high density electronic modules, such as surface mounting technology, limit three-dimensional stacking due to non-planar topologies and complexity in connecting high density pads, making them time-consuming, costly, and prone to improper connections.
Innovation Solution
A method involving embedding a chipset with a die coupled to an interposer into a substrate, forming a window in a wafer, encapsulating the chipset, and creating through-substrate vias for electrical interconnection, allowing for the formation of a high density electronic module with exposed interposer sides for structural support and ease of handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If surface mounting technology is used to mount chipset to PCB, then ease of manufacture is improved, but device complexity increases and three-dimensional stacking is limited due to non-planar topology
Solution Approach 1:
The patent transitions from two-dimensional surface mounting to three-dimensional embedding by mounting the chipset on a wafer that is then embedded within a substrate. This dimensional change enables planar topology while achieving three-dimensional stacking capability, resolving the contradiction between ease of manufacture and device complexity.
Solution Approach 2:
The chipset is mounted on a wafer that is subsequently embedded within the substrate, creating a nested structure where the wafer-with-chipset is contained within the substrate. This nesting approach simplifies the overall topology while maintaining manufacturing ease.
2Device complexity
If interposer is removed from chipset, then device complexity is reduced, but manufacturing precision deteriorates due to complexity of connecting high density pads
Solution Approach 1:
The interposer serves as an intermediary component between the die and the substrate. It provides a simplified interface for connecting high density pads while maintaining manufacturing precision, resolving the contradiction between reduced device complexity and maintained connection precision.
Data Source
AI summary
A method for creating a high density electronic module including the steps of coupling a die to an interposer for form a chipset, mounting the chipset to a substrate, coupling a wafer to the substrate so that the chipset is within a window formed in the wafer, filling the window with encapsulant to encapsulate the chipset, removing the substrate to create a reconstructed wafer, and providing an interconnection structure on the interposer to form the high density electronic module.