Chuck-Based Cleaning Device for Semiconductor Chamber
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Solution Overview
Problem
The semiconductor manufacturing process faces challenges in maintaining high cleanliness levels within manufacturing apparatuses, leading to reduced yield due to particle contaminants and chemical impurities, which are difficult to address through manual cleaning methods that disrupt the manufacturing process and compromise throughput.
Innovation Solution
A chuck-based device is integrated into the semiconductor manufacturing system, equipped with a padding film and a motion mechanism to clean inner surfaces of the chamber without disrupting the vacuum environment, allowing for in-situ cleaning and improved throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual cleaning methods are used to remove contaminants, then cleanliness level is improved, but manufacturing throughput is reduced due to process disruption
Solution Approach 1:
The system uses a wafer carrier equipped with a cleaning mechanism that automatically cleans the chamber interior surfaces during the manufacturing process without requiring external intervention or process interruption. The carrier itself performs the cleaning function as it moves through the chamber.
Solution Approach 2:
The cleaning action is performed in advance or during the manufacturing cycle rather than after contamination occurs. The wafer carrier proactively cleans surfaces as it traverses the chamber, preventing contaminant accumulation that would require subsequent manual cleaning.
2Object-affected harmful factors
If manual cleaning is performed to remove particle contaminants and chemical impurities, then contamination level is reduced, but manufacturing process is interrupted
Solution Approach 1:
The cleaning operation continues uninterrupted alongside the manufacturing process. The wafer carrier performs cleaning actions during its normal operational cycle, maintaining continuous manufacturing throughput while simultaneously removing contaminants from chamber surfaces.
Solution Approach 2:
The cleaning function is merged with the wafer carrier's normal manufacturing operations. The same carrier that transports wafers also performs cleaning, combining two separate functions into a single integrated system that eliminates the need for separate cleaning cycles.
3Productivity
If in-situ cleaning is implemented using a chuck-based device, then manufacturing throughput is improved, but device complexity increases
Solution Approach 1:
The wafer carrier is designed to serve multiple functions: it transports wafers during manufacturing and simultaneously performs cleaning of chamber surfaces. This multi-functionality reduces the need for separate dedicated cleaning equipment, thereby limiting the increase in overall system complexity.
Solution Approach 2:
The cleaning mechanism utilizes a flexible padding film attached to the wafer carrier. This simple, adaptable component can conform to various chamber surface geometries and is easily replaced or adjusted, avoiding the need for complex rigid mechanical cleaning systems.
Data Source
AI summary
The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber with the chuck-based device configured to clean the chamber, a loading port coupled to the chamber and configured to hold one or more wafer storage devices, and a control device configured to control a translational displacement and a rotation of the chuck-based device. The chuck-based device can include a based stage, one or more supporting rods disposed at the base stage and configured to be vertically extendable or retractable, and a padding film disposed on the one or more supporting rods.