Electrostatic Chuck Heater Layout for Uniform In-Plane Temperature
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Solution Overview
Problem
Current electrostatic chucks in semiconductor manufacturing struggle to achieve uniform in-plane temperature distribution during processing, which is crucial for miniaturization and increased integration density of semiconductor elements, as existing heater structures do not adequately address the need for precise temperature control and uniformity.
Innovation Solution
An electrostatic chuck with a ceramic dielectric substrate and a heater unit comprising a first and second heater element, where the second heater element has multiple main zones and a larger number of sub-zones, with power feeding portions strategically positioned to enhance temperature uniformity, including the placement of power feeding portions overlapping central and peripheral regions of the sub-zones to ensure even heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a two-layer heater structure (main heater and sub-heater) is used, then heating speed is improved, but in-plane temperature distribution uniformity is insufficient
Solution Approach 1:
The heater is divided into multiple independent heating zones (first heating zone, second heating zone, third heating zone) with different numbers of heating lines. The first and second heating zones each have multiple heating lines, while the third heating zone has fewer heating lines, creating a gradient structure that addresses temperature uniformity across different regions of the substrate
Solution Approach 2:
Different regions of the heater are designed with different heating line densities to match the local thermal requirements. The first and second heating zones have higher heating line density for areas requiring more heat, while the third heating zone has lower density for areas requiring less heat, achieving local optimization of temperature distribution
2Manufacturing precision
If more heating lines are added to improve temperature uniformity, then in-plane temperature distribution is improved, but device complexity increases
Solution Approach 1:
The heater is segmented into three distinct heating zones with different numbers of heating lines. This segmentation allows the system to achieve comprehensive temperature coverage without requiring every region to have the maximum number of heating lines, thus reducing overall complexity while maintaining uniformity
Solution Approach 2:
Instead of providing equal heating capacity across all zones, the invention uses partial heating action in the third zone (fewer heating lines) where less heat is needed, avoiding the excessive complexity that would result from uniformly high heating line density across the entire heater
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the uniformity of in-plane temperature distribution across the process object, enhancing processing accuracy and enabling the miniaturization and increased integration density of semiconductor elements by ensuring consistent heat application.
Implementation Method 1
a main heater line generating heat by allowing a current to flow
Implementation Method 2
an electrostatic chuck applies an electrostatic clamping power to built-in electrodes and clamps a substrate such as a silicon wafer by an electrostatic force
Data Source
AI summary
An electrostatic chuck includes a ceramic dielectric substrate; a base plate; and a heater unit which heats the ceramic dielectric substrate. The heater unit includes first and second heater elements. The second heater element has a plurality of main zones separated from each other in a radial direction. The first heater element has a plurality of sub-zones separated from each other. A number of the sub-zones is larger than a number of the main zones. The main zones include a first main zone. The first main zone has a main heater line and a first main power feeding portion. The sub-zones include a first sub-zone overlapping the first main zone. The first sub-zone has a central region and an outer peripheral region. The first main power feeding portion is provided at a position where the first main power feeding portion overlaps the central region.