Circuit Assembly Bus Bar Mounting Terminal Routing
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Solution Overview
Problem
In electronic components with terminals extending from the side surface, increased terminal lengths lead to resistance losses and poor heat dissipation, and connecting terminals within the package contour to external circuit patterns is challenging.
Innovation Solution
A circuit assembly with a sheet substrate connected to the terminal within the package contour and bonded to bus bars using a pressure-sensitive adhesive sheet, allowing electrical connection to external targets and improving heat dissipation by reducing terminal length and height differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If terminals extend from the side surface of the package, then the electronic component can be connected to external circuits, but the terminal length increases causing resistance losses and poor heat dissipation
Solution Approach 1:
The patent transitions terminals from extending outward in one dimension (side surface extension) to being contained within the package footprint (two-dimensional planar integration). The sheet substrate routes signals laterally across the package bottom surface, changing the dimensional approach from vertical/protruding connections to horizontal/integrated connections, thereby reducing terminal length and resistance while maintaining external connectability.
Solution Approach 2:
The sheet substrate and terminals are nested within the contour of the package lower surface. The conductive paths are embedded in the package structure rather than extending externally, creating a nested configuration where the connection infrastructure is contained within the package boundaries, reducing exposed terminal length and improving heat dissipation.
2Ease of operation
If terminals extend from the side surface, then external connections are enabled, but heat dissipation properties deteriorate
Solution Approach 1:
By routing connections through the sheet substrate across the package bottom surface rather than extending terminals vertically from the side, the patent increases the surface area in contact with the package for heat dissipation. The lateral routing approach distributes thermal load across a larger area, improving thermal management while maintaining electrical connectability.
Solution Approach 2:
The sheet substrate acts as an intermediary between the internal circuit nodes and external connection points. It provides both electrical connectivity and thermal conduction pathways, mediating the transfer of both signals and heat away from sensitive components while maintaining compact packaging.
3Ease of operation
If a sheet substrate is used to connect terminals within the package contour to external targets, then electrical connection is achieved, but assembly complexity increases
Solution Approach 1:
The patent merges multiple functions into the sheet substrate: it serves as the circuit board, provides terminal connections, enables external interfacing, and acts as a mounting structure. By combining these functions into a single integrated component, the overall assembly complexity is reduced despite the sophisticated functionality achieved.
Solution Approach 2:
The sheet substrate is designed as a multi-functional element that simultaneously provides electrical connectivity, structural support, and thermal management capabilities. This universal component approach reduces the number of separate parts needed, simplifying assembly while achieving complex electrical connection requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient electrical connection of internal terminals to external targets, reduces resistance losses, and enhances heat dissipation properties while simplifying assembly through unitary fixation of components.
Implementation Method 1
a pressure-sensitive adhesive sheet that bonds the circuit substrate and the sheet substrate to the plurality of bus bars
Data Source
AI summary
A circuit assembly includes: a circuit substrate that has an upper surface on which a circuit pattern has been formed; a plurality of bus bars that are connected to the circuit substrate, and are fixed to a lower surface of the circuit substrate, the plurality of bus bars being spaced apart from each other; an electronic component that includes a package disposed on the bus bar, and a terminal provided within a contour of a lower surface of the package; a sheet substrate that includes one end connected to the terminal and the other end disposed outside the contour of the lower surface of the package; and a pressure-sensitive adhesive sheet that bonds the circuit substrate and the sheet substrate to the plurality of bus bars.