Circuit Assembly Heat Spreading Plate Warping Prevention

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Solution Overview

Problem

Conventional electrical junction boxes face challenges in preventing warping of circuit boards due to heat generation by electronic components, which can lead to defects in the conductive paths and reduced manufacturing efficiency.

Innovation Solution

A circuit assembly design that includes a circuit board with a heat dissipation plate and a separate heat spreading plate, where an insulating adhesive layer is used between the circuit board and the heat spreading plate, and the heat spreading plate is fixed to the heat dissipation plate using fixing means, enhancing heat dissipation and reinforcing the circuit board to prevent warping.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a single heat dissipation plate is attached to the circuit board, then heat dissipation is improved, but the circuit board may still warp due to insufficient reinforcement

Engineering Contradiction:

Improveheat dissipationVSAvoidcircuit board warping

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The heat dissipation function is divided into two separate components: a heat spreading plate that contacts the circuit board to collect and distribute heat, and a heat dissipation plate that dissipates heat to the environment. This segmentation allows each component to be optimized for its specific function while providing adequate reinforcement to prevent warping.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention uses a composite structure combining the heat spreading plate and heat dissipation plate with different material properties. The heat spreading plate is designed to be in intimate contact with the circuit board for heat collection, while the heat dissipation plate provides additional structural support and heat dissipation capability, creating a composite reinforcement system.

Inventive Principle:

Principle #40Composite materials

2Volume of moving object

If electronic components are mounted on a thin circuit board, then device miniaturization is achieved, but the circuit board becomes prone to warping

Engineering Contradiction:

Improvedevice sizeVSAvoidcircuit board warping

Core Design Contradiction:

Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The dual-plate heat dissipation structure acts as a composite reinforcement system that provides mechanical support to the thin circuit board. The heat spreading plate in direct contact with the board and the heat dissipation plate working together create a stiffened structure that prevents warping while allowing the use of thin boards for miniaturization.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The heat dissipation plates are strategically positioned and sized to provide reinforcement specifically in areas where warping is most likely to occur, while maintaining the overall thin profile of the circuit board in other areas. This localized reinforcement allows miniaturization without compromising structural stability.

Inventive Principle:

Principle #3Local quality

3Power

If heat is generated by electronic components, then device functionality is achieved, but the heat can cause defects in conductive paths

Engineering Contradiction:

Improveelectronic component activationVSAvoidconductive path integrity

Core Design Contradiction:

PowerVSReliability

Solution Approach 1:

The heat spreading plate serves as an intermediary between the heat-generating electronic components and the heat dissipation plate. It collects heat from multiple components across its surface and distributes it uniformly, preventing localized overheating that could damage conductive paths, while the heat dissipation plate efficiently removes the heat from the system.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively suppresses warping of the circuit board, improves heat dissipation, and increases manufacturing efficiency by ensuring stable connections between the conductive paths and electronic components, leading to enhanced production of circuit assemblies and electrical junction boxes.

Implementation Method 1

heat generated in an electronic component during its activation is transmitted to the circuit board, and transmitted to the heat spreading plate via the adhesive layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Heat transmitted to the heat spreading plate is uniformized due to distribution in the heat spreading plate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

heat transmitted to the heat spreading plate is transmitted to the heat dissipation plate fixed to each other by fixing means and dissipated from the heat dissipation plate

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS10448497B2Circuit assembly and electrical junction box

Publication Date: 2019.10.15 AUTONETWORKS TECH LTD

AI summary

A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.