Printed Circuits Stress/Warp Reduction TRIZ Cases

Asymmetric inner conductor thickness and tapered vias suppress warpage by balancing thermal expansion differences across the core layer.

A surface mount coil component integrates a thermoplastic resin layer on its mounting surface to secure input-output terminals via interlayer connection conductors.

A circuit board element reduces thermal stress on the glass substrate by using a dielectric layer with a thicker central region and thinner edges.

A component carrier uses a rounded transition portion between rigid and flexible sections to distribute mechanical loads.

Nested insulating materials surround a glass core in a printed circuit board, preventing toast defects and cracks when cutting unit boards.

Exposing heat-radiating conductor layer side faces reduces thermal expansion and warping while lowering manufacturing costs.

A BGA masking dam with an integrated seal protects solder joints from conformal coating overflow during circuit board manufacturing.

Curved side edges distribute stress at junctions, preventing circuit line breakage when IC tags are folded.

A decoupling capacitor connects parallel substrates to reduce parasitic mesh inductances.

A circuit assembly uses a separate heat spreading plate and insulating adhesive layer to manage thermal loads on the board.

A curable composition using carboxyl-containing polyurethane and epoxy prevents wiring breakage during assembly of flexible boards.

Silane-treated inorganic filler lowers substrate elasticity, reducing warpage while maintaining connection reliability.

Naphthalene epoxy resins and treated inorganic fillers prevent swelling during soldering, resolving heat resistance issues in thick insulating layers.

A fiber-reinforced resin member with a concavo-convex shape covers the circuit chip and antenna wiring of an RFID tag.

Distinct composition intermetallic compound layers disperse delamination stress from residual solvent vaporization, preventing conductor breakage.

Selective metal coating on float glass compensates for thermal expansion mismatch, suppressing convex warpage in printed wiring board laminates.

Alternating reinforcing and non-reinforcing resin layers balance printed wiring board strength to reduce warpage while maintaining uniform conductor thickness.

A glass substrate carrier structure uses a buffer layer to enhance circuit adhesion and prevent micro cracks during manufacturing.

A ring-shaped magnetic element embedded in a PCB substrate groove prevents short circuits and protects adhesive layers during high-temperature processing.

A printed circuit board balances a protruding auxiliary substrate using an electronic component counterweight on the main surface.

Simulation model iteratively adjusts resin content in asymmetric PCB layers to minimize warpage and reduce manufacturing waste.

A transparent shielding electrode connects to a patterned compensation electrode via a dedicated structure.

Recessed pads beneath conductive pillars balance conductor distribution to reduce warpage and improve connection reliability.

A vibration dampening frame with ridges supports PCBs and increases resonant frequency.

Varying surface roughness in through-hole insulator layers anchors interlayer connection conductors to prevent dislodging.

Segmented Au and Cr barrier layers block etching liquid from damaging copper conductors, improving reliability.

Different core and external insulation resins reduce plated hole positional shifts while preserving signal transmission speed.

Different solder resist fillers create density gradients that counteract thinness-induced warpage, preventing moisture penetration at the substrate interface.

Segmented conductive layers with localized voids mitigate warpage tendency while maintaining electrical connectivity for high-density arrays.

A coreless printed circuit board incorporates a high-rigidity structural layer to enhance mechanical strength and maintain adhesion between circuit layers.