PCB Package Structure with Ring-Shaped Magnetic Element
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Solution Overview
Problem
Conventional printed circuit board manufacturing processes and package structures cause stress to magnetic elements, leading to degraded electrical characteristics and increased material and time costs, as well as the risk of short circuits due to inadequate handling of glass fibers during drilling.
Innovation Solution
A three-layer printed circuit board package structure with a ring-shaped magnetic element, conductive channels, and gas channels, where the conductive channels are arranged at specific angles relative to the glass fibers to prevent short circuits and the use of pressure relief holes to manage stress and heat, reducing the need for additional adhesive material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If all copper on the back side of the substrate is removed by etching before laminating copper foil, then the manufacturing process can be completed, but material is wasted and process time increases
Solution Approach 1:
The patent applies preliminary action by pre-forming containing grooves on the front side of the substrate before etching the back side copper. This allows the magnetic elements to be positioned and secured earlier in the process, enabling the back side copper removal to be performed more efficiently without compromising the overall manufacturing completion.
Solution Approach 2:
The patent segments the manufacturing process into distinct stages: front side groove formation, magnetic element placement, and back side copper removal. This segmentation allows each operation to be optimized independently, reducing total process time while ensuring proper manufacturing completion.
2Ease of manufacture
If all copper on the back side of the substrate is removed by etching, then the process can be completed, but the thickness of copper foil becomes smaller than the copper on the substrate, reducing structure strength
Solution Approach 1:
The containing grooves are formed on the front side before the back side copper is removed. This preliminary action provides structural support and positioning for magnetic elements during the copper removal process, maintaining structure strength even when back side copper thickness is reduced.
Solution Approach 2:
The patent applies local quality by creating containing grooves at specific locations where magnetic elements will be placed. These localized structural features provide enhanced strength and support precisely where needed, rather than uniformly increasing copper thickness across the entire substrate.
3Productivity
If conventional manufacturing processes are used, then the circuit board can be manufactured, but stress is applied to magnetic elements degrading their electrical characteristics
Solution Approach 1:
The containing grooves are formed before the magnetic elements are placed. This preliminary action secures the magnetic elements in their correct positions and provides mechanical support, preventing stress-induced degradation of their electrical characteristics while maintaining manufacturing efficiency.
Solution Approach 2:
The containing grooves act as a cushioning structure that absorbs and distributes mechanical stress before it reaches the magnetic elements. This beforehand cushioning protects the magnetic elements from stress during subsequent manufacturing processes, preserving their electrical characteristics.
4Ease of manufacture
If the containing groove is filled with adhesive and copper foil is laminated, then the structure is complete, but during IR Reflow the gas in the containing groove expands damaging the adhesive layer and epoxy resin
Solution Approach 1:
The patent extracts the harmful gas from the containing groove by providing gas discharge holes that allow gas to escape during IR Reflow. This prevents gas expansion from damaging the adhesive layer and epoxy resin while maintaining the structural completeness of the filled containing groove.
Solution Approach 2:
The gas discharge holes convert the harmful effect of gas expansion into a beneficial outcome by providing a controlled escape path for the gas. Instead of the gas damaging the adhesive and epoxy, the holes allow safe venting, protecting the surrounding materials.
5Object-affected harmful factors
If high quality adhesive is used to prevent damage during IR Reflow, then the adhesive layer is protected, but the cost increases
Solution Approach 1:
The gas discharge holes extract the harmful gas before it can damage the adhesive layer during IR Reflow. This eliminates the need for expensive high-quality adhesive by providing a structural solution that prevents the damaging gas expansion in the first place.
Solution Approach 2:
The gas discharge holes convert the potential harm of gas expansion into a beneficial protective mechanism. By providing a safe escape path for the gas, the structure itself protects the adhesive layer, eliminating the need for costly alternative adhesive materials.
6Ease of manufacture
If drilling holes are performed without considering glass fiber orientation, then the manufacturing process is simple, but cracks form connecting adjacent channels causing short circuits
Solution Approach 1:
The patent applies preliminary action by analyzing and determining the optimal drilling angles before actual hole formation. This preliminary planning ensures that holes are drilled at angles that avoid cracking along glass fiber paths, preventing short circuits while maintaining manufacturing simplicity through pre-planned drilling patterns.
Solution Approach 2:
The patent changes the drilling parameters, specifically the drilling angle, to optimize for crack prevention. By adjusting the drilling angle relative to the glass fiber orientation, the process maintains simplicity while reliably preventing the formation of cracks that would cause short circuits between adjacent channels.
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
A printed circuit board package structure includes a substrate (110) having a first surface (111) and a second surface (113), a ring-shaped magnetic element (120), an adhesive layer (130), conductive portions (140) and conductive channels (150). The first and second surfaces respectively have first (114) and second (116) metal portions. A ring-shaped concave portion (112) is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall (122) and outside an outer wall (124) of the ring-shaped concave portion. Each of the conductive channels includes a conductive film (152) electrically connects to the aligned conductive portion and second metal portion.