Vibration Dampening Frame for PCBs in High Vibration
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Solution Overview
Problem
Existing solutions for vibration dampening in electronic systems, such as printed circuit boards (PCBs), face challenges including direct vibration transmission, high stress levels, and resonance amplification, often requiring costly and labor-intensive custom designs or materials with thermal expansion issues, which can lead to mechanical stress and failure.
Innovation Solution
A vibration dampening frame made from electrically non-conductive materials, such as glass-filled polyamide, is introduced to support PCBs, featuring ridges and recesses to accommodate components and an elastomeric material for flexible interfaces, which increases resonant frequency, reduces shear strain, and decouples vibrations, while allowing for efficient heat dissipation and automated manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If PCBs are mounted directly to the housing to save cost and part count, then manufacturing cost and part count are reduced, but vibration energy is directly transmitted from the housing to the PCB causing high acceleration levels and stress
Solution Approach 1:
The patent introduces a vibration dampening frame as an intermediary component between the PCB and housing. This frame is made from vibration dampening material that absorbs and dissipates vibration energy, preventing direct transmission to the PCB while maintaining a relatively simple assembly structure
Solution Approach 2:
The vibration dampening frame is constructed from composite materials specifically designed to dampen vibrations. These materials have properties that allow them to absorb vibrational energy while maintaining structural integrity, providing both protection and manufacturability
2Reliability
If potting materials are used in significant volume to provide PCB support and damping, then vibration dampening is improved, but coefficients of thermal expansion mismatch creates mechanical stresses
Solution Approach 1:
The patent extracts the vibration dampening function from the potting material and concentrates it in the vibration dampening frame. This allows for targeted vibration protection without requiring large volumes of potting material, thereby reducing thermal expansion stress while maintaining effective dampening
Solution Approach 2:
The patent changes the physical state and distribution of vibration dampening material from a volumetric potting material to a structured frame component. This parameter change reduces the total volume of dampening material needed while improving its effectiveness and reducing thermal expansion issues
3Reliability
If mechanical assemblies with moving parts are used to isolate PCBs from housings, then vibration isolation is improved, but moving parts wear over time and produce metallic dust
Solution Approach 1:
The patent employs a static vibration dampening frame without moving parts that can serve throughout the product lifecycle. This eliminates wear and metallic dust generation while providing effective vibration isolation, replacing the need for maintenance-prone mechanical assemblies
Solution Approach 2:
The patent replaces mechanical vibration isolation systems with moving parts with a vibration dampening frame made from specialized materials. This substitutes a mechanical system prone to wear with a material-based solution that dampens vibrations through its inherent properties without moving components
4Manufacturing precision
If custom molded parts are used to conform to PCB geometry, then PCB support precision is improved, but hand operated machining is labor intensive and difficult to mass produce
Solution Approach 1:
The patent segments the vibration dampening function into a separate frame component with standardized geometry. This allows the frame to be manufactured independently using automated processes while still providing precise support and dampening functionality when assembled with the PCB
Solution Approach 2:
The vibration dampening frame is designed as a universal component that can accommodate different PCB geometries through its standardized interface and vibration dampening properties. This multi-functional design allows a single component design to serve multiple applications, enabling mass production while maintaining precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces vibration transmission, increases resonant frequency by up to 130%, decreases peak shear strain by 70%, and lowers peak deflection by 70%, enhancing component placement flexibility and reducing thermal resistance, thus improving the reliability and efficiency of PCB assemblies in industrial settings.
Implementation Method 1
An elastomeric material can be used at an interface between the PCBs and frame
Implementation Method 2
The frame can be incorporated into a PCB assembly to reduce the transmission of vibration and mechanical shock from a chassis mount to the PCB
Data Source
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AI summary
A frame for dampening vibrations in a printed circuit board (PCB) assembly is provided. The frame includes a substrate having a first surface and a second surface and multiple ridges extending from at least one of the first and second surfaces. The ridges define recesses, and at least one of the recesses is configured to accommodate an electronic component of a PCB in the PCB assembly. Also provided is a PCB assembly including a PCB and the frame.