Printed Circuit Board Glass Core Insulation for Crack Prevention

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Solution Overview

Problem

Thinner printed circuit boards face issues with warpage and cracks during manufacturing, and the use of a glass core structure can lead to exposure and damage when cutting unit boards, resulting in toast defects and increased defect rates.

Innovation Solution

A printed circuit board design featuring a glass core surrounded by multiple layers of insulating materials, with conductive patterns formed on these layers, and a method of manufacturing that involves forming holes and filling them with insulating materials to prevent direct cutting of the glass core, thereby preventing exposure and damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a glass core structure is used in thinner printed circuit boards, then warpage and cracks during manufacturing are prevented, but the glass core becomes exposed during cutting of unit boards leading to toast defects and increased defect rates

Engineering Contradiction:

Improveprevention of warpage and cracksVSAvoidexposure and damage of glass core during cutting

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The glass core is nested within multiple layers of insulating materials (first insulating material layer surrounding the glass core, second insulating material layer surrounding the first insulating material layer). This nested structure protects the glass core from exposure during cutting operations while maintaining the warpage and crack prevention benefits of the glass core structure.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The first and second insulating material layers act as intermediary protective barriers between the glass core and the external environment during cutting. These intermediary layers prevent direct contact and damage to the glass core while allowing the cutting process to proceed, thereby eliminating toast defects.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the glass core is completely surrounded by insulating materials, then the glass core is protected from exposure and damage, but the manufacturing process complexity increases

Engineering Contradiction:

Improveprotection of glass core from damageVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The insulating material layers are formed around the glass core during the manufacturing process before cutting operations. This preliminary action of surrounding the glass core with protective layers ensures that the glass core is already protected when cutting occurs, eliminating the need for additional protective measures and simplifying the overall process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The formation of insulating material layers is merged with the existing manufacturing process steps. The first insulating material layer is formed as part of the standard insulation process, and the second insulating material layer is added in subsequent processing steps, combining multiple functions into integrated manufacturing operations rather than separate additive steps.

Inventive Principle:

Principle #5Merging (Combining)

3Manufacturing precision

If multiple layers of insulating materials are used to surround the glass core, then the glass core is fully protected from exposure, but the number of manufacturing steps increases

Engineering Contradiction:

Improveprevention of toast defectsVSAvoidmanufacturing cycle time

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

Instead of forming a complete 360-degree surrounding of insulating materials in a single step, the process uses partial action by forming the first insulating material layer around portions of the glass core and the second insulating material layer around remaining portions. This approach achieves full protection while optimizing the manufacturing cycle by distributing the work across existing process steps rather than requiring one excessive long step.

Inventive Principle:

Principle #16Partial or excessive action

Data Source

PatentUS9674944B2Printed circuit board and manufacturing method thereof

Publication Date: 2017.06.06 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A printed circuit board and a method of manufacturing the same are provided. A printed circuit board having conductive patterns formed in multilayers on an insulating material laminated on both surfaces of a glass core is provided. The printed circuit board includes a first insulating material disposed on a first surface and a second surface of the glass core. and a second insulating material disposed on the first insulating material. The first insulating material surrounds a first portion of a side surface of the glass core and the second insulating material surrounds a second portion of the side surface of the glass core, the second portion being a portion of the glass core not surrounded by the first insulating material.