Fingerprint Sensor Sub-board With Through Hole Circuit Element
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Solution Overview
Problem
Existing fingerprint sensing devices face challenges in achieving a thinner design while maintaining structural integrity and preventing deformation during assembly, as they often rely on core layers that can bow or deform without them.
Innovation Solution
The implementation of a sub-board with a through hole and a circuit element of similar thickness, connected via copper connection members, which also serves as a printed circuit board to reinforce the board and reduce overall thickness, along with a sensor array with first and second electrodes in a lattice pattern, and insulating layers to support the circuit patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a core layer is removed to reduce thickness, then the overall thickness is reduced, but the board becomes prone to bowing and deformation
Solution Approach 1:
The board is divided into multiple functional layers including a sensor array layer, insulating layers, and a sub-board with circuit elements. This segmentation allows each layer to perform its specific function while collectively maintaining structural stability without requiring a traditional core layer, thus reducing overall thickness while preventing bowing and deformation
Solution Approach 2:
The invention uses a composite structure combining different materials: the sensor array is embedded in a base layer, insulating layers are positioned above and below, and the sub-board with circuit elements is attached to the bottom surface. This composite material approach provides structural reinforcement and prevents deformation while achieving a thinner profile
2Ease of operation
If circuit elements are mounted on the board surface, then electrical functionality is achieved, but the device thickness increases
Solution Approach 1:
Circuit elements are mounted in a through hole of the sub-board, utilizing the vertical dimension (thickness direction) rather than extending horizontally. This allows electrical functionality to be achieved while minimizing the increase in overall device thickness, as the circuit elements are embedded within the sub-board's depth rather than adding to it
Solution Approach 2:
The circuit elements are nested within the through hole of the sub-board, which itself is attached to the bottom surface of the board. This nested arrangement allows circuit elements to be housed within the existing structural depth, avoiding additional thickness accumulation while maintaining electrical functionality
Data Source
AI summary
A fingerprint sensing device includes a board having a sensor array, a sub-board disposed on a bottom surface of the board, a circuit element disposed on the bottom surface of the board, and a through hole disposed through the sub-board, wherein the circuit element is further disposed in the through hole. A thickness of the sub-board is substantially similar to a thickness of the circuit element.