Dielectric Tape for Non-Planar Heat Sink Cavities
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for applying dielectric and conductive layers to heat sinks with recessed cavities are inefficient, leading to increased material and manufacturing costs and reduced thermal dissipation effectiveness in electronic assemblies.
Innovation Solution
A thick film dielectric tape composed of an organic vehicle, dielectric glass composition, and transition metal oxides is applied directly to substrates with uneven surfaces, providing suitable heat dissipation, electrical performance, and adhesion, while maintaining durability in humid environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screen printing is used to apply dielectric layers to heat sinks, then electrical performance and dielectric properties are improved, but the method cannot be applied to heat sinks with recessed cavities and requires substantially planar surfaces
Solution Approach 1:
The patent changes the physical state and application parameters of the dielectric material from a paste suitable for screen printing to a tape form that can be directly applied to non-planar surfaces. The tape is formed by applying dielectric slip composition to a carrier substrate, drying it to form a green tape, and then applying this tape directly to heat sinks with recessed cavities, eliminating the limitation of screen printing requiring planar surfaces.
2Strength
If mechanical attachment methods are used to attach PCB to heat sink with recesses, then adhesion is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the dielectric layer application and the adhesion functions into a single integrated tape product. The dielectric tape is applied directly to the heat sink surface, eliminating the need for separate mechanical attachment components like screws. This single-step process reduces manufacturing complexity while maintaining adhesion through the inherent bonding properties of the dielectric tape.
Solution Approach 2:
The patent extracts and eliminates the complex mechanical attachment system from the assembly process. Instead of using separate fasteners and mechanical joining methods, the solution takes out these unnecessary components and relies solely on the dielectric tape's ability to adhere directly to the heat sink surface, simplifying the overall manufacturing process.
3Strength
If multiple layers are added between PCB and heat sink for mechanical attachment, then adhesion is improved, but thermal resistance increases
Solution Approach 1:
The patent combines the adhesion function and the thermal interface function into a single dielectric tape layer. This eliminates the need for multiple separate layers (adhesive layers, mechanical fasteners, additional interface materials) that would otherwise be required for mechanical attachment. The single integrated layer maintains strong adhesion while minimizing thermal resistance by reducing the number of interfaces and material layers between the PCB and heat sink.
4Loss of energy
If dielectric slip composition with high glass content is used, then heat dissipation and durability are improved, but manufacturing complexity increases
Solution Approach 1:
The patent optimizes the composition parameters of the dielectric slip composition to achieve a balance between performance and manufacturability. The composition includes 30-70 wt% glass frit, 5-20 wt% metal oxide, and 20-40 wt% organic vehicle, which provides adequate heat dissipation and durability while maintaining processability. The organic vehicle ensures proper flow and adhesion during application, and the formulation allows for direct tape formation without complex processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dielectric tape enables efficient formation of hybrid thick film circuits with fewer manufacturing steps, reducing costs and maintaining thermal dissipation properties, and adheres well to substrates with recessed cavities, enhancing the durability and electrical performance of electronic devices.
Implementation Method 1
Metal core PCBs (MCPCBs) are generally formed of a base metal, typically aluminum, copper, or alloys thereof, that acts as a heat sink to dissipate heat away from the integral electronic components of the PCB
Implementation Method 2
removing the solvent from the dielectric slip composition
Data Source
AI summary
A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.