Printed Circuit Board Heat Dissipation via Exposed Conductor Sides
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Solution Overview
Problem
Conventional printed circuit boards experience poor heat-radiating properties due to heat accumulation in the solder resist layer, leading to thermal expansion and warping issues, and require multiple printing processes on the heat-radiating surface, increasing costs and process time.
Innovation Solution
A printed circuit board design featuring a heat-radiating conductor layer with exposed side faces and a solder resist layer forming a convex laminate, which enhances heat dissipation and reduces thermal expansion, while minimizing the number of printing processes on the heat-radiating surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the solder resist layer covers the heat-radiating conductor layer completely, then the manufacturing process is simple, but the heat-radiating property deteriorates due to heat accumulation
Solution Approach 1:
The solder resist layer is segmented to cover only the upper surface of the heat-radiating conductor layer, leaving the side surfaces exposed. This segmentation allows the structure to maintain manufacturing simplicity while improving heat radiation by exposing portions of the conductor layer to the environment.
Solution Approach 2:
The invention transitions from a two-dimensional complete coverage configuration to a three-dimensional partial coverage configuration. By exposing the side surfaces of the heat-radiating conductor layer, the design utilizes the vertical dimension to improve heat radiation without complicating the manufacturing process.
2Manufacturing precision
If multiple printing processes are performed on the heat-radiating surface, then the solder resist layer can be formed accurately, but the process cost and time increase
Solution Approach 1:
The invention merges the formation of the solder resist layer with a single printing process rather than requiring multiple separate processes. By forming the solder resist layer in one step and then exposing the side surfaces of the heat-radiating conductor layer, the process time is reduced while maintaining the required accuracy for soldering.
3Volume of moving object
If the heat-radiating conductor layer is completely covered, then the structure is compact, but thermal expansion causes warping and twisting
Solution Approach 1:
The complete coverage of the heat-radiating conductor layer is segmented to expose the side surfaces. This segmentation provides thermal expansion relief by allowing the conductor layer to expand and contract freely on its sides, preventing the warping and twisting that would occur with complete coverage.
Solution Approach 2:
The invention applies different coverage characteristics to different portions of the heat-radiating conductor layer. The upper surface is covered with the solder resist layer for compactness, while the side surfaces are exposed to accommodate thermal expansion, creating a locally optimized structure that balances compactness with dimensional stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat radiating efficiency and mechanical characteristics by exposing the heat-radiating conductor layer's side faces, reducing thermal expansion and warping, and lowering process costs through reduced printing steps.
Implementation Method 1
heat generated from the part assembling conductor layer 114 of the circuit surface is thermally conducted to the heat-radiating conductor layer 120 of the heat-radiating surface
Implementation Method 2
the side face of the heat-radiating conductor layer 20 is exposed... promotes the heat radiating effect
Implementation Method 3
the thermal expansion of a copper foil serving as the heat-radiating conductor layer 120 is caused, with the result that a problem of warping and twisting is raised
Data Source
AI summary
The object of the present invention is to provide a printed circuit board that improves the heat radiating effect as the entire printed circuit board and a manufacturing method for such a printed circuit board. A printed circuit board includes a base member having two main surfaces, at least one heat-radiating conductor layer formed on at least one of the main surfaces of the two main surfaces of the base member and a solder resist layer formed on a surface of the heat-radiating conductor layer, and in this printed circuit board, the heat-radiating conductor layer has two main surfaces and at least one side face, the heat-radiating conductor layer has its one main surface of the two main surfaces made in planar contact with the main surface of the base member, the solder resist layer further has an etching liquid resistance, and is formed on the other main surface of the two main surfaces of the heat-radiating conductor layer, with the side face of the heat-radiating conductor layer being exposed, and the heat-radiating conductor layer and the solder resist layer are allowed to form a laminate 24 having a substantially convex shape with an appropriate height.