Circuit Board Insulator Surface Roughness for Conductor Adhesion
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Solution Overview
Problem
Conventional circuit boards experience connection failures between interlayer connection conductors and conductor layers due to insufficient mechanical and surface roughness differences between insulator layers, leading to signal loss and reliability issues.
Innovation Solution
A circuit board design featuring insulator layers with varying Young's modulus and surface roughness, where the second insulator layer has a higher Young's modulus and larger surface roughness within through-holes, ensuring strong adhesion of interlayer connection conductors and preventing them from dislodging during deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulator layers with uniform properties are used, then manufacturing is simple, but connection failure occurs between interlayer connection conductors and conductor layers
Solution Approach 1:
The patent applies local quality by creating insulator layers with different Young's modulus values at different locations. Specifically, the insulator layer has a first region with a first Young's modulus and a second region with a second Young's modulus that is higher than the first. This local variation in mechanical properties prevents connection failure between interlayer connection conductors and conductor layers while maintaining overall structural integrity.
Solution Approach 2:
The patent changes the physical parameter of Young's modulus within the insulator layer structure. By having regions with different Young's modulus values, the patent optimizes the mechanical properties for different functional requirements - one region provides flexibility for conductor layer attachment while another region provides rigidity for structural support, thereby preventing connection failures.
2Reliability
If insulator layers with different Young's modulus are used, then connection reliability improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements local quality by dividing the insulator layer into distinct regions with different Young's modulus values. The first region has a first Young's modulus and the second region has a higher second Young's modulus. This regional differentiation achieves reliable connections without requiring extreme precision across the entire layer, as each region can be optimized independently for its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces connection failures and signal loss by enhancing the anchor effect of interlayer connection conductors, maintaining reliable electrical connections even under mechanical stress.
Implementation Method 1
radiating a laser beam from a space located in the negative direction of the first insulator layer and the second insulator layer to form a through-hole that passes through the first insulator layer and the second insulator layer
Data Source
AI summary
An interlayer connection conductor is inside a through-hole extending through first and second insulator layers in a Z-axis direction. A first conductor layer is on a negative main surface of an insulator layer farther in a negative direction of the Z-axis than the second insulator layer, and in contact with an end portion of the interlayer connection conductor in the negative direction of the Z-axis. A second conductor layer is on a positive main surface of the second insulator layer and in contact with an end portion of the interlayer connection conductor in a positive direction of the Z-axis. A surface roughness of a portion in the second insulator layer inside the through-hole is larger than a surface roughness of a portion in the first insulator layer inside the through-hole. No conductor layer in contact with the interlayer connection conductor is provided between the first and second insulator layers.