PCB Counterweight Design for Vibration Balance

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Solution Overview

Problem

In printed circuit boards, the auxiliary board's perpendicular protrusion causes weight imbalance, leading to amplified vibration and potential release of solder fixing when mounted on devices generating vibration, such as compressor mounting devices.

Innovation Solution

A printed circuit board design featuring a first insulating substrate with a mounting hole and a second insulating substrate with a connection portion protruding through the hole, where the center of mass of the second substrate is on the first substrate's surface, and an electronic component with a weight equivalent to the second substrate's weight is placed on the second substrate, ensuring orthogonal alignment and balanced vibration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the auxiliary board perpendicularly protrudes from the mother board, then the connection between substrates is simplified, but the weight balance is biased and vibration is amplified

Engineering Contradiction:
Improvesubstrate connection structureVSAvoidweight balance
Core Design Contradiction:
Device complexityVSStability of the object's composition

Solution Approach 1:

The patent introduces a counterweight structure on the mother board that opposes the weight of the protruding auxiliary board. This counterweight is positioned to create a balanced center of gravity, preventing the weight bias caused by the perpendicular protrusion of the auxiliary board while maintaining the simplified connection structure.

Inventive Principle:
Principle #8Anti-weight (Counterweight)

2Device complexity

If the auxiliary board perpendicularly protrudes from the mother board, then the connection between substrates is simplified, but solder fixing is released due to amplified vibration

Engineering Contradiction:
Improvesubstrate connection structureVSAvoidsolder fixing reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

By introducing a counterweight structure that balances the center of gravity, the patent reduces the amplified vibration that occurs when the auxiliary board perpendicularly protrudes. This reduction in vibration prevents the solder fixing from being released, thereby maintaining reliable connections between substrates while keeping the connection structure simple.

Inventive Principle:
Principle #8Anti-weight (Counterweight)

3Stability of the object's composition

If counterweight measures are taken to balance vibration, then vibration amplification is prevented, but the entire weight of the printed circuit board increases

Engineering Contradiction:
Improvevibration balanceVSAvoidprinted circuit board weight
Core Design Contradiction:
Stability of the object's compositionVSWeight of moving object

Solution Approach 1:

The counterweight is strategically positioned in a specific local area of the mother board rather than distributing weight throughout the entire board. This localized approach achieves vibration balance by counteracting the specific imbalance caused by the protruding auxiliary board, while minimizing the overall weight increase of the printed circuit board.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design prevents vibration amplification and solder fixing release without increasing the board's weight, maintaining stable fixation even under vibrational conditions.

Implementation Method 1

a second electrode provided on the connection portion and joined to the first electrode by solder

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentUS11432403B2Printed circuit board
Publication Date: 2022.08.30 MITSUBISHI ELECTRIC CORP
  • US11432403B2 patent drawing
  • US11432403B2 patent drawing
  • US11432403B2 patent drawing

AI summary

A printed circuit board includes: a first insulating substrate having a mounting hole that penetrates through the first insulating substrate from a first surface to a second surface; a second insulating substrate including a connection portion; a first electrode provided on the second surface and disposed at an edge of the mounting hole; a second electrode provided on the connection portion and joined to the first electrode; and an electronic component provided on the second surface. A center of mass of the second insulating substrate is disposed on the first surface of the first insulating substrate. A center of mass of the electronic component is disposed on the second surface of the first insulating substrate. The electronic component has a weight equivalent to a weight of the second insulating substrate.