Component Built-in Wiring Substrate Moisture Dispersion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing component built-in wiring substrates face issues with peeling and floating of electronic components due to thermal expansion and moisture accumulation, leading to defects in the adhesion between conductor layers and resin insulating layers.
Innovation Solution
The implementation of a component built-in wiring substrate design featuring a first resin insulating layer, a first conductor layer with a component mounting pad, a second conductor layer connected via conductors, and a second resin insulating layer with a component accommodating portion, where through holes in the conductor patterns disperse moisture and enhance adhesion, preventing peeling and floating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are mounted on a solid plain layer in a cavity, then the component can be accommodated and sealed, but peeling and floating occur due to thermal expansion and moisture accumulation
Solution Approach 1:
The patent divides the mounting structure into multiple segments: a component mounting pad on the first conductor layer, via conductors penetrating through the first resin insulating layer, and a second conductor layer on the opposite side. This segmented approach distributes thermal stress and prevents peeling by creating multiple adhesion points rather than relying on a single solid plain layer.
Solution Approach 2:
The via conductors act as intermediary elements connecting the first conductor layer (with component mounting pad) and the second conductor layer. These via conductors penetrate through the first resin insulating layer, providing mechanical anchoring and electrical connection that prevents peeling and floating caused by thermal expansion and moisture accumulation.
2Reliability
If via conductors are formed to connect conductor layers, then electrical connection is established, but moisture accumulation may occur leading to adhesion defects
Solution Approach 1:
The patent extracts or removes moisture from the interface regions by forming via conductors that penetrate through the resin insulating layer. The via conductors create pathways that prevent moisture accumulation at the conductor-resin interfaces, thereby preventing adhesion defects while maintaining electrical connectivity.
3Manufacturing precision
If a component accommodating portion is formed in the resin insulating layer, then component placement precision is improved, but the structure becomes more complex
Solution Approach 1:
The component accommodating portion is formed preliminarily in the first resin insulating layer before final component mounting. This pre-formed structure provides a precise guide and support for component placement, ensuring accurate positioning while integrating smoothly with the existing multi-layer conductor and insulator structure.
Data Source
AI summary
A component built-in wiring substrate includes a first insulating layer, a first conductor layer formed on a first surface of the first insulating layer and including a component mounting pad, a second conductor layer formed on a second surface of the first insulating layer on the opposite side with respect to the first surface, via conductors formed in the first insulating layer such that the via conductors are connecting the second conductor layer and the component mounting pad of the first conductor layer, a second insulating layer formed on the first insulating layer and having a component accommodating portion penetrating through the second insulating layer such that the component mounting pad is positioned at bottom of the accommodating portion, and an electronic component positioned in the accommodating portion of the second insulating layer such that the electronic component is mounted on the component mounting pad of the first conductor layer.