Decoupling Capacitor Between Parallel Substrates
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Solution Overview
Problem
Existing three-dimensional power electronic circuits with surface-mounted components face challenges in transferring potential between substrates without creating short circuits and suffer from bulkiness and performance limitations due to parasitic mesh inductances and mechanical instability, especially at high frequencies and voltages.
Innovation Solution
A decoupling capacitor is positioned between two substrates with electrodes connected to each substrate, forming a spacer that reduces mesh inductances and enhances mechanical resistance, using a configuration where the capacitor's electrodes are aligned perpendicular to the substrates and connected via conductive tracks, with dielectric materials ensuring optimal distance and breakdown voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a decoupling capacitor is positioned between two substrates with electrodes connected to each substrate, then parasitic mesh inductances are reduced and mechanical stability is improved, but the risk of short circuit between substrates increases
Solution Approach 1:
The patent introduces a dedicated insulation structure as an intermediary element between the capacitor electrodes and the substrates. This insulation layer acts as a mediator that prevents direct electrical contact between components at different potentials, thereby eliminating the short circuit risk while preserving the electrical connection function of the capacitor to reduce parasitic inductance.
Solution Approach 2:
The patent segments the electrical connection path by separating the conductive function (capacitor electrodes connecting to substrates) from the insulation function (dedicated insulation structure). This segmentation allows the capacitor to perform its electrical function of reducing mesh inductance while the dedicated insulation structure independently manages the short circuit prevention, resolving the contradiction between electrical performance and safety.
2Reliability
If the potential difference between substrates is significant, then voltage resistance is ensured by spacing between substrates, but the module becomes bulky
Solution Approach 1:
The patent transitions the insulation approach from a three-dimensional spacing requirement to a two-dimensional planar insulation layer. Instead of increasing the distance between substrates in the vertical dimension to achieve voltage resistance, the insulation function is achieved through a dedicated insulation structure in the horizontal plane, thereby maintaining compact module dimensions while ensuring adequate voltage resistance.
Solution Approach 2:
The dedicated insulation structure serves as a mediator that provides voltage resistance without requiring increased spacing between substrates. This insulation layer acts as an intermediate barrier that handles the voltage stress, allowing the substrates to remain closely spaced and thus keeping the module compact while maintaining the required voltage resistance level.
3Ease of manufacture
If a third substrate is used to mount the decoupling capacitor as proposed in existing solutions, then the capacitor can be positioned between substrates, but parasitic mesh inductances increase and mechanical stability decreases
Solution Approach 1:
The patent extracts the insulation function from the substrate structure and assigns it to a dedicated insulation component. By taking out the insulation requirement from the substrate design, the capacitor can be directly mounted between substrates without requiring an additional third substrate for mounting, thereby eliminating the parasitic inductances and mechanical instability introduced by the overhanging third substrate configuration.
Solution Approach 2:
The patent makes the capacitor mounting structure multi-functional by enabling the capacitor to simultaneously serve its electrical decoupling function and its mechanical positioning function. The capacitor is directly mounted between the two substrates without requiring a separate third substrate, thereby achieving both electrical performance (reduced parasitic inductance) and mechanical stability while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces parasitic mesh inductances, improves mechanical stability, and enhances the compactness of the electrical module, optimizing performance for high-frequency and high-voltage applications while minimizing electrical losses and surges.
Implementation Method 1
a decoupling capacitor (5) positioned between the first substrate (11) and the second substrate (12), said decoupling capacitor (5) comprising a first electrode (51) electrically connected and secured to a contact (111) of the first substrate (11), and a second electrode (52) electrically connected and secured to a contact (121) of the second substrate (12)
Implementation Method 2
with dielectric materials ensuring optimal distance and breakdown voltage
Implementation Method 3
connected via conductive tracks
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
The invention concerns a three-dimensional electrical module (1), comprising: - first and second parallel substrates (11, 12), each of said first and second substrates having an electrical contact (111, 121) orientated towards the other of said first and second substrates; - a capacitor (5) comprising: - a first electrode (51) electrically connected and rigidly attached to the contact (111) of the first substrate (11), and - a second electrode (52) electrically connected and rigidly attached (121) to the second substrate (12); - a continuity of material being formed between the first and second substrates, perpendicularly to the first and second substrates, and across said capacitor (5).