Glass Substrate Carrier Structure with Buffer Layer for Crack Prevention

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Solution Overview

Problem

Conventional substrate manufacturing processes for glass substrates often result in micro cracks due to stress, leading to poor adhesion of thick copper inner circuits, which fail reliability verification tests.

Innovation Solution

A carrier structure with a buffer layer on both surfaces of a glass substrate and within through holes, where the inner circuit layer is formed on the buffer layer, enhancing adhesion and preventing micro cracks, and including dielectric and conductive layers for electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a thick copper inner circuit is fabricated on a glass substrate surface, then the electrical connectivity is improved, but micro cracks occur due to stress causing poor adhesion

Engineering Contradiction:

Improveadhesion of circuit layerVSAvoidmicro cracks

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a buffer layer as an intermediary between the glass substrate and the copper inner circuit layer. This buffer layer absorbs stress and prevents micro crack formation, thereby improving adhesion reliability without compromising electrical connectivity

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates a composite structure consisting of multiple layers (glass substrate, buffer layer, copper inner circuit layer, dielectric layers) where each material contributes specific properties. The composite structure distributes stress and prevents crack propagation while maintaining electrical functionality

Inventive Principle:

Principle #40Composite materials

2Strength

If stress is applied during the manufacturing process, then the circuit layer adheres to the substrate, but micro cracks are generated that are difficult to detect

Engineering Contradiction:

Improveadhesion strengthVSAvoidmicro crack detection

Core Design Contradiction:

StrengthVSDifficulty of detecting and measuring

Solution Approach 1:

The buffer layer is applied beforehand to cushion and absorb stress during the manufacturing process. This prevents micro crack formation at the interface between the glass substrate and copper circuit layer, eliminating the detection problem while maintaining adhesion strength

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If a buffer layer is added to improve adhesion, then reliability is improved, but the device structure becomes more complex

Engineering Contradiction:

Improvereliability verificationVSAvoidlayer structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent segments the structure into distinct functional layers (glass substrate, buffer layer, copper inner circuit layer, dielectric layers) with clear interfaces. This segmentation allows each layer to perform its specific function while maintaining overall reliability, and the modular structure facilitates manufacturing and quality control

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20200163215A1Carrier structure and manufacturing method thereof

Publication Date: 2020.05.21 UNIMICRON TECH CORP

AI summary

A carrier structure including a glass substrate, a buffer layer, and an inner circuit layer is provided. The glass substrate has a first surface, a second surface opposite to the first surface, and at least one through hole penetrating through the glass substrate. The buffer layer is disposed on the first surface and the second surface of the glass substrate. The inner circuit layer is disposed on the buffer layer and in the through hole of the glass substrate. The inner circuit layer exposes a part of the buffer layer.