Circuit Assembly Mounting Area via Inverted Substrate

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Solution Overview

Problem

In circuit assemblies, the need to form through-holes for electronic component mounting reduces the available mounting area on the substrate, limiting the space for conductive patterns and increasing structural complexity.

Innovation Solution

The substrate is fixed to the surface of a conductive member opposite to where the electronic component is supported, eliminating the need for through-holes and allowing for increased mounting area, with a relay member connecting the electronic component's terminals to the substrate and a heat dissipation member enhancing thermal efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a through-hole is formed in the substrate for mounting electronic components, then electronic components can be mounted on the conductive member, but the mounting area of the substrate decreases

Engineering Contradiction:

Improveelectronic component mounting capabilityVSAvoidsubstrate mounting area

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The invention transitions from a two-dimensional mounting approach (components on substrate surface) to a three-dimensional arrangement (components mounted on conductive member above substrate). This allows the substrate to maintain its full area for circuit patterns while components are supported in the vertical dimension by the conductive member.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The invention separates the functions of substrate and conductive member: the substrate provides electrical connection and mechanical support for circuit patterns, while the conductive member provides support for electronic components. This functional segmentation allows each component to optimize its role without compromising the other.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If a through-hole is formed in the substrate, then electronic components can pass through to reach the conductive member, but the structural complexity increases

Engineering Contradiction:

Improveelectronic component connectionVSAvoidsubstrate structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Instead of passing components through the substrate from one side to the other, the invention inverts the approach by mounting components on the conductive member surface. This eliminates the need for through-holes and complex substrate routing while achieving the same electrical connection functionality.

Inventive Principle:

Principle #13The other way round (Inversion)

3Ease of manufacture

If the substrate is fixed to the conductive member surface that supports electronic components, then assembly is simplified, but the mounting area of the substrate decreases

Engineering Contradiction:

Improveassembly simplicityVSAvoidsubstrate mounting area

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The invention resolves this contradiction by fixing the substrate to the opposite surface of the conductive member, utilizing the vertical dimension to accommodate both the substrate attachment and component mounting without spatial conflict. This maintains full substrate area availability while achieving simple assembly structure.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration increases the substrate's mounting area, simplifies the structure, and improves heat dissipation efficiency by allowing direct or indirect contact between the electronic component and the heat dissipation member without air layers.

Implementation Method 1

The electronic component and the heat dissipation member are in direct or indirect contact with each other. Doing this makes it possible to effectively dissipate heat generated in the electronic component via the heat dissipation member (form a structure in which the entire space between the electronic component and the heat dissipation member is not an air layer).

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10652994B2Circuit assembly with increased mounting area

Publication Date: 2020.05.12 AUTONETWORKS TECH LTD

AI summary

Provided is a circuit assembly in which the mounting area of a substrate can be increased. A circuit assembly includes an electronic component having a plurality of terminals, a conductive member for supporting the electronic component (10), at least one of the terminals of the electronic component being electrically connected to the conductive member, and a substrate provided with a conductive pattern to which another terminal of the electronic component is electrically connected, in which the substrate is fixed to a surface of the conductive member that is opposite to a surface of the conductive member that supports the electronic component.