Electronic Circuit Assembly Process for Component Property Detection

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing electronic circuit assembly systems face challenges in efficiently mounting components with varying electrical properties without pre-determined property values and supply positions, leading to potential mismatches and errors in circuit performance.

Innovation Solution

An electronic-circuit assembling process that includes obtaining and providing property-related information for components with different electrical properties, allowing for accurate recognition and mounting on a circuit board, even when properties and supply positions are unknown, through detection and correlation of component supplier information.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If component supply positions are not predetermined and electrical property values are not known in advance, then the system gains flexibility in component selection and supply arrangement, but the accuracy of component mounting and circuit performance deteriorates due to potential mismatches and errors

Engineering Contradiction:
Improveflexibility in component selectionVSAvoidaccuracy of component mounting
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The system performs preliminary detection of component supply positions and electrical property values before the mounting process begins. The detection unit scans component suppliers to identify component types and their electrical properties, and determines the actual supply positions in advance, so that this information is available before mounting starts, resolving the contradiction between flexibility and precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system implements a feedback mechanism where the detection unit continuously monitors component supply positions and electrical property values, and the control unit uses this feedback information to adjust mounting operations in real-time. This ensures that even with flexible component selection and variable supply positions, the mounting accuracy and circuit performance are maintained through continuous information updating and correction.

Inventive Principle:
Principle #23Feedback

2Adaptability or versatility

If the system waits to determine electrical property values and supply positions during assembly, then flexibility is maintained, but the assembly time increases due to detection steps

Engineering Contradiction:
Improveflexibility in assembly processVSAvoidassembly speed
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The detection of component supply positions and electrical property values is performed continuously and automatically during the assembly process rather than as separate discrete steps. The detection unit operates in parallel with the mounting process, continuously scanning and updating component information, which maintains flexibility while avoiding time loss from sequential detection operations.

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The system replaces manual detection and identification methods with automated optical or electromagnetic detection units that can rapidly scan and identify component properties and positions. This substitution of detection technology enables fast, automatic gathering of component information without slowing down the assembly process, maintaining both flexibility and productivity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS9204586B2Electronic-circuit assembling process
Publication Date: 2015.12.01 FUJI CORP
  • US9204586B2 patent drawing
  • US9204586B2 patent drawing
  • US9204586B2 patent drawing

AI summary

An electronic-circuit assembling process to be carried out in an electronic-circuit assembling system, for assembling an electronic circuit, by mounting electronic circuit components supplied from a component supplier, onto a circuit board, wherein the electronic circuit components includes at least one of different-property components having respective different electrical properties. The process includes: (a) a different-property-component-related information obtaining step of obtaining a different-property-component-related information including (a-i) a property-related information that enables recognition of the electrical property of the different-property component supplied from the component supplier and (a-ii) a different-property-component supply position that is a position of the component supplier supplying the different-property component, such that the different-property-component-related information is obtained by detecting the property-related information and/or the different-property-component supply position; (b) a mounting step of mounting, based on information related to the different-property-component supply position, the electronic circuit components including the different-property component, onto the circuit board; and (c) a property-related information providing step of providing the circuit board with the property-related information of the different-property component mounted on the circuit board.