Printed Circuit Manufacture TRIZ Cases

Using a sub-circuit board as a bulkhead contains potting compound in open housings, reducing part count and manufacturing costs.

A reconfigurable island-based network flow processor uses a configurable mesh data bus to route packet traffic between functional circuit blocks.

A mounting system aligns an optical lens with a light emitting unit using deviation thresholds to maintain luminance.

An electronic circuit assembly process detects component properties and supply positions during mounting to ensure accurate association.

An intermediary poly(arylene ether) adhesive resolves the contradiction between low dielectric constant and adhesion strength in halogen-free circuit materials.

Aluminum transition pads welded directly to copper traces eliminate intermediate nickel tabs, reducing manufacturing steps and strengthening connections.

A printed circuit uses catalytic ink with electroless nickel and galvanic copper layers to form conductive paths.

A tool-less extension card apparatus secures to expansion terminals via guide blocks and retention mechanisms.

Antimony suppresses flux reactivity to extend pot life and ensure transparent residue.

A gas nozzle integrated into a sealing flap structure distributes protective gas to maintain uniform flow within the soldering hood.

A polymeric leveling agent with unsaturated nitrogen heterocycles deposits uniform copper metal layers during electroplating.

A support member maintains constant distance between lens and image sensor, preventing optical performance loss from adhesive shrinkage.

Right angle backplane connectors stack memory cards vertically to reduce trace length and resolve signal integrity issues in high-speed data transfers.

Segmented electrode patterns with distinct layer thicknesses reduce sputtering and etching times, preventing residual films and enhancing process yield.

Integrating bevel formation into edge routing eliminates extra manufacturing steps while maintaining connector alignment.

Silane-modified polyimide composition eliminates adhesive layers to resolve thickness and dimensional stability issues in fine pitch circuits.

A replenishing device detects interfering objects to enable automatic orthogonal draw-out of work stations.

A poly(p-xylylene)-based polymer with tailored aryl substituents provides low dielectric constant insulation for high-density circuit boards.

Chemical composition modifies copper grain structure to resolve insufficient adhesion of solder masks on narrow conductor lines.

A passivation layer on a nitride ceramic substrate prevents bubble formation at the interface, improving thermal conductivity and reliability.

Phase change material layers embedded in printed circuit board stacks absorb thermal energy during phase transitions to provide enhanced cooling.

A laser processing method combines stationary and synchronization techniques to optimize table movement across varying hole densities.

Segmenting LDS additives into the surface layer maintains mechanical strength while enabling precise conductor track formation.

Starting the inkjet ejection from the middle prevents thick ends at the start position, maintaining line width uniformity and avoiding bulges.

Circular stamp segmentation maintains consistent contact pressure to resolve cross-web chatter and pattern irregularities in roll-to-roll operations.

Composite TCO and metal micro-wire electrodes resolve transparency-conductivity trade-offs in large touch screens.

A display device contact part electrically connects a flexible film lead electrode to a substrate pad part through sintered conductive material.

Conductive nickel particles in an epoxy resin connect bus-bar electrodes to wiring members, eliminating flux residue resistance.

A wiring substrate uses a coating film on conductive layers to enhance adhesion between the first conductive layer and the second insulating layer.

A warm spraying method deposits aluminum powder onto ceramic substrates to form dense metal layers with high adhesiveness.

A thin solder layer bonds ceramic and metal substrates, reducing silver consumption while improving thermal stability.

A support for electronic units features an open cavity and a hollow column with an integrated channel.

A stretchable display panel functional pattern measures elongation through capacitance changes during flexible printed circuit board bonding.

A piezoelectric ink-jet head connects a driver IC on a chip-on-film to a flexible printed circuit board via exposed contacts.

Differentiating inspection machine resolving powers for small and large components reduces total inspection time while maintaining reliability.

Corner electrodes concentrate the electric field to improve signal-to-noise ratio and touch detection accuracy.

Mold recess geometry compensates for edge effects to achieve uniform metal thickness, eliminating post-processing polishing steps.

An anion-trapping agent prevents premature polymerization termination in low-temperature curing.

An embedded smart module integrates insulating and circuit layers within a twistable substrate to reduce layout area.

An aqueous acidic stripping composition removes photoresist films and metal-containing residues from indium tin oxide surfaces.

Replacing ceramic substrates with flexible polymers enables miniaturization while adhesive layers enhance heat dissipation.

A two-component curable resin composition uses viscosity-controlled agents to enhance printability and dispersibility.

Dummy patterns on the touch connection circuit board anchor the protective layer to prevent flow and cracks during bending, reducing bezel dead space.

A light irradiating device heats ink droplets at an acute angle to partially evaporate them before ejection.

A thermally conductive plastic plate dissipates heat from power devices via a direct encapsulant interface.

A suction nozzle cleaning mechanism moves the internal pipe relative to the holding tube using gas pressure.

Vertical stacking of circuit and conductive layers via insulating vias reduces frame width by eliminating bending regions that limit space utilization.

A silicon-based display integrates an embedded driving circuit with a flexible circuit board using conductive adhesive for stable electrical bonding.

Compliant interposer material between card and receptacle contact arrays ensures reliable coupling despite alignment tolerances.

A fixed camera captures the entire movable region of a component mounting machine within a single image, enabling easy determination of error causes.