Flexible Substrate Resistive Device for Miniaturization and Heat Dissipation

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Solution Overview

Problem

Traditional resistive devices with ceramic substrates face limitations in miniaturization due to brittleness and poor heat dissipation, and conventional adhesives with glass fibers restrict flexibility and heat transfer.

Innovation Solution

A resistive device with a flexible substrate made of plastic materials like polyimide or PET, combined with a resistive layer of alloys such as Ni-Cu and an adhesive layer for heat dissipation, eliminating the need for ceramic substrates and glass fibers, allowing for miniaturization and improved heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a ceramic substrate is used in traditional resistive devices, then heat stability of resistance is improved, but miniaturization is limited due to brittleness and hardness

Engineering Contradiction:

Improveheat stability of resistanceVSAvoidsize of resistive device

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent changes the fundamental parameter of substrate material from ceramic to flexible polymer material. This parameter change enables the substrate to be thin and flexible while maintaining structural integrity, allowing miniaturization of the resistive device without sacrificing heat stability through the use of alternative heat dissipation mechanisms

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite structure where a flexible polymer substrate is combined with a copper foil layer for heat dissipation and a resistive layer for electrical function. This composite material approach replaces traditional ceramic substrates while achieving both miniaturization and heat stability through the synergistic properties of the composite layers

Inventive Principle:

Principle #40Composite materials

2Strength

If conventional adhesive with glass fiber material is used, then support strength is improved, but flexibility is reduced and heat dissipation is blocked

Engineering Contradiction:

Improvesupport strength of adhesiveVSAvoidflexibility of resistive device

Core Design Contradiction:

StrengthVSEase of operation

Solution Approach 1:

The patent changes the material parameter of the adhesive from glass fiber-based to a flexible polymer-based adhesive layer. This parameter change maintains adequate bonding strength while eliminating the flexibility restrictions and heat dissipation blockage caused by glass fiber materials, enabling the resistive device to be both flexible and thermally efficient

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The flexible substrate and adhesive layer enable reduced size, increased flexibility, and enhanced heat dissipation, overcoming the limitations of traditional devices by providing a stable and efficient resistive device suitable for miniaturization and various applications.

Implementation Method 1

because glass fiber material has poor heat dissipation and may block the heat transfer from the substrate 11 toward the resistive layer 12 or the copper foil layer 13

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS9024204B2Aresistive device with flexible substrate and method for manufacturing the same

Publication Date: 2015.05.05 CYNTEC

AI summary

A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.