Embedded Smart Module Twistable Substrate Bending Durability

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Solution Overview

Problem

Conventional wearable electronic devices face challenges in circuit design due to the need for multiple layers and conductive vias, which makes them prone to breakage when bent.

Innovation Solution

The embedded smart module integrates the insulating layer within the electrode layer and the circuit layer within the insulating layer, reducing the layout area and overall thickness, and allowing for a twistable substrate that can be bent without breaking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If multiple layers and conductive vias are used to drive electronic devices, then the circuit design capability is improved, but the device complexity increases and reliability decreases due to bending breakage

Engineering Contradiction:

Improvecircuit design capabilityVSAvoidstructure complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent embeds the insulating layer within the electrode layer, and the circuit layer within the insulating layer, creating a nested structure where multiple functional layers are integrated within each other rather than stacked separately. This nesting approach maintains circuit design capability while reducing overall structural complexity and eliminating the need for conductive vias to pass through multiple discrete layers.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent merges the insulating layer and electrode layer into a single integrated structure where the insulating layer is disposed within the electrode layer. This merging eliminates the need for separate conductive vias to connect through distinct layers, thereby reducing structural complexity while maintaining circuit functionality.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If multiple layers and conductive vias are disposed between circuit layers, then the circuit design capability is improved, but the reliability deteriorates due to bending breakage

Engineering Contradiction:

Improvecircuit design capabilityVSAvoidbending durability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

By nesting the insulating layer within the electrode layer and the circuit layer within the insulating layer, the patent creates an integrated structure where conductive paths are embedded within insulating material rather than requiring through-vias that cross multiple separate layers. This eliminates stress concentration points at via interfaces, significantly improving bending durability while maintaining circuit design capability.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent employs a twistable substrate that can be bent or twisted without breaking the embedded circuit structures. The nested layer configuration allows the entire assembly to flex uniformly without creating stress concentrations that would cause breakage at via interfaces, thereby enhancing reliability under bending conditions.

Inventive Principle:

Principle #30Flexible shells and thin films

3Ease of manufacture

If conventional multi-layer structure is used, then the circuit design capability is achieved, but the layout area and overall thickness increase

Engineering Contradiction:

Improvecircuit design capabilityVSAvoidlayout area

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The nested configuration allows the insulating and circuit layers to occupy the same horizontal footprint rather than requiring additional layout area for separate layer stacking. The vertical integration of layers within each other's volume reduces the horizontal space required, thereby reducing layout area while maintaining full circuit design capability.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent transitions from a conventional horizontal stacking of layers to a vertical nesting arrangement where layers are disposed within each other in the vertical dimension. This dimensional reorganization reduces the horizontal layout area by utilizing the vertical space more efficiently, allowing multiple functional layers to coexist within a smaller footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12207401B2Embedded smart module

Publication Date: 2025.01.21 NAT TAIPEI UNIV OF TECH

AI summary

An embedded smart module including a twistable substrate, an electrode layer, a circuit layer, an insulating layer, an electronic component and a sensing component is provided. The electrode layer is disposed on the twistable substrate. The circuit layer is disposed in the electrode layer and exposed at the surface of the electrode layer. The insulating layer is disposed between the electrode layer and the circuit layer. The electronic component is disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer. The sensing component is disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer.