PCB Embedded Phase Change Material Thermal Management
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Solution Overview
Problem
The increasing use of high power components in electronics assemblies poses a challenge for thermal management, as existing advanced thermal management techniques can increase product size, weight, and cost, and introduce additional points of failure.
Innovation Solution
Incorporating one or more phase change material layers between the conductive and dielectric layers of a printed circuit board (PCB) or metal core PCB, which absorb thermal energy during a phase transition to provide enhanced cooling without the need for complex thermal management systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If advanced thermal management techniques (heat sinks, thermo-electric cooler, liquid cooling) are implemented, then thermal performance is improved, but product size, weight and cost increase
Solution Approach 1:
The patent embeds phase change material layers within the PCB structure that utilize phase transition to absorb heat at a constant temperature. This passive thermal management approach eliminates the need for active cooling systems, thereby reducing product weight while maintaining effective thermal performance.
Solution Approach 2:
The phase change material layers are integrated directly into the PCB manufacturing process, merging the thermal management function with the structural board. This consolidation eliminates separate thermal management components, reducing overall product weight without compromising cooling effectiveness.
2Temperature
If advanced thermal management techniques are implemented, then thermal performance is improved, but device complexity increases
Solution Approach 1:
The phase change material provides passive, autonomous thermal management without requiring external power sources or control systems. The material automatically absorbs heat during phase transition, eliminating the need for complex active cooling systems and reducing overall device complexity.
Solution Approach 2:
The utilization of phase change materials enables passive thermal management through natural phase transition processes. This approach eliminates the need for motors, pumps, or electronic controls associated with active cooling systems, thereby significantly reducing device complexity while maintaining thermal performance.
3Temperature
If advanced thermal management techniques are implemented, then thermal performance is improved, but reliability decreases due to additional points of failure
Solution Approach 1:
The patent extracts the thermal management function from complex active systems and implements it through simple passive phase change material layers. By removing motors, pumps, and electronic controls, the solution eliminates additional failure points while maintaining effective thermal performance, thereby improving product reliability.
Solution Approach 2:
The phase change material provides self-regulating thermal management without requiring external power or control systems. This passive approach eliminates the reliability issues associated with active cooling systems that have moving parts and electronic components, as the phase change process is inherently reliable and maintenance-free.
4Temperature
If phase change material layers are embedded in PCB, then thermal management is enhanced without increasing size, but manufacturing complexity increases
Solution Approach 1:
The PCB structure is segmented into functional layers, with phase change material layers positioned between dielectric or conductive layers. This segmentation allows the thermal management function to be independently optimized and manufactured using standard PCB fabrication processes, reducing overall manufacturing complexity while enhancing thermal management effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively manages high thermal loads while minimizing size, weight, and cost, and increases the reliability of the PCB assembly by eliminating moving parts and additional electronic components.
Implementation Method 1
During a phase change, the one or more phase change material layers are configured to absorb thermal energy at a phase transition temperature to provide enhanced cooling of the printed circuit board
Implementation Method 2
absorb thermal energy at a phase transition temperature
Data Source
AI summary
An electronic assembly comprises a printed circuit board including a plurality of stacked layers, wherein the stacked layers comprise a plurality of conductive layers, a plurality of dielectric layers respectively interposed between the conductive layers, and one or more phase change material layers interposed between at least one pair of the dielectric layers or at least one pair of the conductive layers. During a phase change, the one or more phase change material layers are configured to absorb thermal energy at a phase transition temperature to provide enhanced cooling of the printed circuit board. In some embodiments, the printed circuit board can be a metal core printed circuit board.