Silicon Substrate OLED with Embedded Driving Circuit and Flexible Circuit Board
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Solution Overview
Problem
The development of silicon-based micro OLED technology for VR/AR applications requires advanced flexible printed circuit designs and laminating processes to ensure reliable connection and structural stability, particularly in miniaturized and high-PPI displays, where existing solutions face challenges in maintaining electrical conductivity and structural integrity.
Innovation Solution
A display configuration incorporating a silicon substrate with an embedded driving circuit and a flexible circuit board with specific reinforcement plates and wiring layers, utilizing an anisotropic conductive adhesive for electrical connection, ensures stable bonding and structural stability by maintaining a non-zero distance between reinforcement plates and the substrate, preventing oxidation and ensuring reliable signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the flexible circuit board is made thinner to achieve miniaturization, then the device size is reduced, but the structural strength and reliability of the connection deteriorate
Solution Approach 1:
The patent employs composite material structures including the flexible circuit board composed of multiple layers (flexible substrate, wiring layers, insulation layers) and the reinforcement plate made of rigid material. This composite construction allows the overall assembly to maintain high strength while keeping individual components thin and flexible, resolving the contradiction between miniaturization and connection strength.
Solution Approach 2:
The flexible circuit board is segmented into multiple functional layers (flexible substrate, first wiring layer, insulation layer, second wiring layer) with the reinforcement plate as a separate structural component. This segmentation allows each layer to be optimized independently - the flexible substrate provides flexibility, the wiring layers provide electrical connection, and the reinforcement plate provides structural strength without increasing overall thickness.
2Ease of manufacture
If the flexible circuit board is made more flexible to facilitate assembly, then the ease of manufacture is improved, but the structural stability and reliability of electrical connection deteriorate
Solution Approach 1:
The flexible circuit board exhibits different mechanical properties in different regions - the flexible substrate and wiring layers provide flexibility for assembly in areas requiring bending, while the reinforcement plate provides rigid structural support and stability in areas requiring electrical connection reliability. This local differentiation of material properties resolves the contradiction between flexibility for assembly and stability for connection.
3Volume of moving object
If the driving circuit is embedded in the silicon substrate to achieve miniaturization, then the device size is reduced, but the manufacturing complexity increases
Solution Approach 1:
The driving circuit is merged with the silicon substrate through embedding, where the driving circuit is formed within the silicon substrate itself rather than as a separate component. This merging reduces the overall display size by eliminating the need for separate circuit boards and reduces the number of assembly steps, thereby decreasing manufacturing complexity despite the advanced semiconductor processing required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability and stability of electrical connections between the flexible circuit board and the silicon-based OLED, improving bonding yield and signal transmission performance while preventing oxidation and conductive particle accumulation, thus addressing the challenges of miniaturization and high-PPI requirements in VR/AR displays.
Implementation Method 1
the second pad is electrically connected with the first pad by a conductive adhesive layer
Data Source
AI summary
A display includes a display substrate and a flexible circuit board. The display substrate includes a silicon substrate, a driving circuit of which at least part is embedded in the silicon substrate, and a first pad electrically connected with the driving circuit. The driving circuit includes a transistor with a semiconductor layer; the flexible circuit board includes a flexible substrate, a first wiring layer, and a first reinforcement plate. The first wiring layer includes a main wiring portion and a second pad electrically connected with the main wiring portion, and the second pad is electrically connected with the first pad by a conductive adhesive layer. The first reinforcement plate covers the main wiring portion and does not cover the second pad. The first reinforcement plate is located outside the display substrate and there is a non-zero distance between the first reinforcement plate and the display substrate.