Electronic Unit Mount With Insulating Channel
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Solution Overview
Problem
Existing electrical devices integrated into machines require large quantities of insulating material for effective insulation, leading to high production costs and potential short-circuits at electrical connections.
Innovation Solution
A support for electronic units with an open cavity and a hollow column, featuring a channel that allows for efficient insulation and reduced material usage, ensuring effective insulation without increasing device size or production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large quantity of insulating material is used to guarantee effective insulation, then insulation reliability is improved, but production cost increases
Solution Approach 1:
The support is divided into multiple functional zones: an open cavity for receiving electronic units, hollow columns for electrical connection elements, and channels for material flow. This segmentation allows insulating material to be strategically placed only where needed (in hollow columns and channels) rather than throughout the entire support structure, reducing total material quantity while maintaining insulation reliability at critical electrical connection points
Solution Approach 2:
The design applies insulating material locally within hollow columns and channels where electrical connection elements are positioned, rather than uniformly across the entire support. This localized application ensures effective insulation at critical interfaces between electronic units while minimizing unnecessary material usage in non-critical areas, thereby reducing production costs
2Reliability
If a large quantity of insulating material is used to guarantee effective insulation, then insulation reliability is improved, but the device size increases
Solution Approach 1:
The support structure is segmented into compact functional elements (open cavity, hollow columns, channels) that are tightly integrated. Insulating material is confined to specific hollow columns and channels rather than filling the entire support volume, enabling effective insulation without increasing overall device size
Solution Approach 2:
The hollow columns are nested within the support structure, with insulating material contained within these columns. The channels are integrated into the support body, allowing material to flow through predefined pathways. This nesting approach ensures insulation is provided exactly where needed without adding external volume to the device
3Reliability
If traditional insulation methods are used, then insulation coverage is improved, but material consumption increases
Solution Approach 1:
The support is segmented into open cavities for electronic units, hollow columns for electrical connection elements, and channels for material flow. This segmentation directs insulating material precisely to hollow columns and channels where electrical connection elements require insulation, eliminating material waste in non-critical areas while ensuring complete coverage at insulation-critical interfaces
Solution Approach 2:
Insulating material is applied locally within hollow columns and channels where electrical connection elements are positioned, rather than uniformly across the entire support structure. This localized application ensures effective insulation at critical interfaces while minimizing total material quantity required
Data Source
Figure 1
Figure 2~3
AI summary
The invention relates to a support for an electronic unit, in particular an electronic card, intended to be integrated into a housing to support a first electronic unit (18) and to allow an electrical connection between the first electronic unit (18) and a second electronic unit (12) located opposite, via at least one electrical connection element (22), said support (20) comprising: - an open cavity (28) intended to receive the first electronic unit (18); - a hollow column (32) in which at least one electrical connection element (22) is intended to be inserted, the hollow column (32) extending from the open cavity (28) and being configured to communicate with the open cavity (28) at a first end (34) of the hollow column (32); and - a channel (38) comprising one end communicating with the bottom (30) of the open cavity (28) and another end communicating with a lateral wall of the hollow column (32).