Flexible Display Panel Stacked Circuit Layers Reduce Frame Width
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Solution Overview
Problem
Existing display panel designs face challenges in reducing the width of the frame due to bending regions, which limits the utilization rate and space efficiency, especially in chip-on-glass, chip-on-flex, and chip-on-panel configurations.
Innovation Solution
A display panel design featuring a flexible base with a circuit layer, insulating layer, and conductive layer stacked sequentially, where via connections allow electrical contact between the conductive and circuit layers, eliminating the need for bending and enabling overlapping regions for improved space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the circuit layer is bent to the back surface of the base substrate to reduce frame width, then the frame width is reduced, but bending regions are created that limit space utilization
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked structure. The circuit layer, insulating layer, and conductive layer are stacked vertically in the thickness direction, allowing the circuit to be positioned at the back surface without bending. This vertical stacking eliminates the need for bending regions while maintaining frame width reduction, thereby improving space utilization in the plane direction.
Solution Approach 2:
The patent divides the structure into distinct functional layers: a circuit layer for electrical connections, an insulating layer with via holes for electrical isolation and connection, and a conductive layer for signal transmission. This segmentation allows each layer to perform its specific function independently, enabling the circuit to be routed to the back surface without requiring bending, thus eliminating bending regions and improving overall space utilization.
2Ease of operation
If via connections are used to connect conductive and circuit layers, then electrical connection is achieved without bending, but manufacturing complexity increases
Solution Approach 1:
The insulating layer serves as an intermediary between the circuit layer and the conductive layer. It contains via holes that act as mediators for electrical connection, allowing signals to pass through while maintaining insulation between different circuit regions. This intermediary structure enables direct vertical electrical connections without bending, simplifying the overall manufacturing process compared to bent configurations.
Solution Approach 2:
The via holes are formed in the insulating layer during the manufacturing process before final assembly. This preliminary action of creating pre-formed connection pathways through the insulating layer simplifies subsequent assembly steps, as the electrical connections are already established through the stacked layers without requiring complex bending and positioning operations.
Data Source
AI summary
A display panel includes a flexible base, and a circuit layer, an insulating layer, and a conductive layer that are sequentially stacked on the flexible base. The circuit layer is configured to be bonded to an external circuit structure. The conductive layer is configured such that electrical signals transmitted between the conductive layer and the circuit layer. At least one via is provided in the insulating layer, and the conductive layer is electrically connected to the circuit layer through the at least one via. At least one opening corresponding to at least partial region of the circuit layer is provided in the flexible base, and the at least one opening is configured to receive at least part of the circuit structure.