Thermally Conductive Plastic Plate for Power Supply Thermal Management
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Solution Overview
Problem
Conventional power supply systems face challenges in thermal management due to high costs and limited effectiveness of insulated metal substrates and gap pads, which restrict efficient heat transfer from power devices to baseplates.
Innovation Solution
A power supply apparatus utilizing a thermally conductive plastic plate and encapsulant with heat-spreading layers on a circuit board to enhance conductive cooling, reducing costs and improving thermal conductance by minimizing the distance between the plate and circuit board, and optimizing the use of thermally conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If insulated metal substrates are used to facilitate baseplate cooling, then thermal management is improved, but manufacturing cost increases and device complexity increases
Solution Approach 1:
The patent replaces expensive insulated metal substrates with a cost-effective alternative: a plastic baseplate combined with a thermally conductive encapsulant. This encapsulant is applied directly to the circuit board and provides sufficient thermal management without requiring costly metal substrate construction, thereby reducing manufacturing cost while maintaining thermal performance.
Solution Approach 2:
The patent uses a composite structure consisting of a plastic baseplate and a thermally conductive encapsulant material. This composite approach combines the electrical insulation and mechanical stability of plastic with the thermal conductivity of the encapsulant, achieving effective thermal management without the cost and complexity of metal substrates.
2Temperature
If gap pads are used to facilitate heat transfer from power devices to baseplate, then thermal transfer is improved, but manufacturing cost increases and device complexity increases
Solution Approach 1:
The patent merges the functions of the gap pad and the baseplate into a single integrated structure. The thermally conductive encapsulant is applied directly to the circuit board surface, eliminating the need for separate gap pads. This integration simplifies the device structure while maintaining effective heat transfer from power devices to the baseplate.
Solution Approach 2:
The patent extracts and eliminates the gap pad component from the assembly by incorporating its thermal transfer function directly into the encapsulant layer. This removal of the separate gap pad element reduces device complexity and manufacturing steps while preserving the essential heat transfer capability.
3Temperature
If gap pads are used to facilitate baseplate cooling, then thermal transfer is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive gap pads with a cost-effective encapsulant material that provides sufficient thermal transfer performance. The encapsulant is applied directly to the circuit board, eliminating the need for additional gap pad components and reducing overall manufacturing cost while maintaining thermal management effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a synergistic cooling effect, effectively dissipating heat generated by power devices with lower manufacturing costs and improved thermal conductance, suitable for high-power applications.
Implementation Method 1
a thermally conductive encapsulant between the first surfaces of the circuit board and the plate
Implementation Method 2
the circuit board comprises one or more heat-spreading layers configured to enhance heat transfer in directions parallel to the first surface of the circuit board
Data Source
AI summary
Power supply apparatus (10) comprising a circuit board (11) and one or more power devices (12) attached to a first surface (11a) of the circuit board (11). A plate (14a) composed of a thermally conductive plastic faces the first surface of the circuit board (11). A thermally conductive encapsulant (15) is provided between the first surfaces (11a) of the circuit board (11) and the plate (14a). The circuit board (11) comprises one or more heat-spreading layers (212*,213*) configured to enhance heat transfer in directions parallel to the first surface (11a) of the circuit board (11). The first surface (14aa″) of the plate (14a) may also be irregular and comprises one or more first regions (32) and one or more second regions (31) that are further from the first surface (11a) of the circuit board (11) than the one or more first regions (32), with the one or more power devices (12) being aligned with the one or more second regions (31).