Substrate Inspection System with Variable Resolving Power
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Solution Overview
Problem
Current substrate process systems require longer inspection times and may not reliably inspect components due to the uniformity of inspection machines, which can be improved by utilizing inspection machines with varying resolving powers for small and large components.
Innovation Solution
A substrate process system with a high-resolving power first inspection machine for detailed small component inspection and a low-resolving power second inspection machine for large components, along with a program to determine the optimal number of process machines based on takt time, allowing for efficient and reliable inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple inspection machines with uniform high resolving power are used to ensure reliable inspection of all components, then inspection reliability is improved, but inspection time increases
Solution Approach 1:
The patent applies local quality by assigning different resolving powers to different inspection machines based on their position in the process and the size of components they inspect. The first inspection machine has high resolving power for small components, while the second inspection machine has low resolving power for large components. This differentiated approach ensures reliable inspection where needed while reducing unnecessary inspection time for components that don't require high resolution.
2Productivity
If multiple inspection machines are added to decrease inspection time, then productivity is improved, but device complexity increases
Solution Approach 1:
The patent changes the parameter of resolving power across different inspection machines rather than using identical machines. The first inspection machine is configured with high resolving power for detailed inspection of small components, while the second inspection machine uses low resolving power for rapid inspection of large components. This parameter differentiation allows the system to achieve high productivity through parallel processing while managing complexity by optimizing each machine's capabilities for its specific inspection task.
3Measurement precision
If high resolving power inspection is applied to all components, then measurement precision is improved, but inspection time increases
Solution Approach 1:
The patent applies partial action by using high resolving power only when necessary - specifically for the first inspection machine that inspects small components requiring detailed examination. The second inspection machine uses low resolving power for large components where high precision is not required. This selective application of high measurement precision avoids the time penalty that would result from applying high-resolution inspection to all components uniformly.
Data Source
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AI summary
In a substrate process system which includes a plurality of arranged process machines 18, 78, 80, and 90, and in which a circuit substrate is transported from an upstream process machine to a downstream process machine, the process machine 80 inspects small electronic components, and the process machine 90 inspects large electronic components. The small mounted components are preferably inspected in detail; however, when the detailed inspection is performed, an inspection process time increases. In contrast, when the large mounted components are inspected, it is not necessary to inspect the large electronic components in detail to the degree that the small electronic components are inspected. For this reason, according to this system, it is possible to reliably inspect the small mounted components even though the inspection process requires a certain length of time, and it is possible to inspect the large components in less detail than the inspection process for the small components. Accordingly, it is possible to reliably perform an inspection process, and to decrease an inspection time at the same time.