Circuit Assembly with Rough Surface Heat Dissipation Member

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Solution Overview

Problem

Conventional circuit assemblies experience a decrease in heat dissipation properties due to nonuniform adhesive pressure, leading to insufficient adhesion between the circuit member and the heat dissipation member.

Innovation Solution

A circuit assembly with a rough surface heat dissipation member and an insulating layer that penetrates the protrusions and recessions of the surface, eliminating the need for adhesive and reducing stress on the circuit board, while incorporating heat insulating grooves and heat dissipation grease for efficient heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive bonding is used to fix the circuit board to the heat dissipation member, then the circuit board can be fixed to the heat dissipation member, but the adhesion becomes insufficient depending on the location due to nonuniform pressure, resulting in a decrease in heat dissipation properties

Engineering Contradiction:

Improveadhesion strengthVSAvoidheat dissipation properties

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent introduces a rough surface layer as an intermediary between the adhesive and the heat dissipation member. This rough surface layer penetrates into the protrusions and recessions of the rough surface, creating a mechanical interlocking effect that enhances adhesion uniformity across the bonding interface, thereby preventing localized adhesion insufficiency and maintaining heat dissipation performance

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the surface morphology parameter of the heat dissipation member by creating a rough surface with protrusions and recessions. This parameter change transforms the bonding mechanism from simple adhesive contact to mechanical interlocking, ensuring uniform pressure distribution and consistent adhesion strength across the entire bonding area

Inventive Principle:

Principle #35Parameter changes

2Strength

If the circuit board is pressed against the heat dissipation member during bonding, then the circuit board can be fixed to the heat dissipation member, but nonuniform pressure application causes insufficient adhesion in certain locations

Engineering Contradiction:

Improvebonding strengthVSAvoidadhesion uniformity

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent applies local quality by creating a rough surface with distributed protrusions and recessions across the heat dissipation member. This local structural variation ensures that the adhesive penetrates and bonds uniformly at multiple locations simultaneously, eliminating the problem of nonuniform pressure application and achieving consistent adhesion strength across the entire bonding interface

Inventive Principle:

Principle #3Local quality

3Strength

If adhesive is used for fixation, then the circuit board can be fixed to the heat dissipation member, but separate fastening components are required, increasing device complexity

Engineering Contradiction:

Improvefixation strengthVSAvoidcomponent configuration

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent merges the adhesive layer with the rough surface structure into a single integrated bonding interface. The rough surface layer serves both as the bonding medium and as part of the heat dissipation member, eliminating the need for separate fastening components and simplifying the overall device configuration while maintaining fixation strength

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses heat dissipation property decreases, reduces the risk of soldering defects, and simplifies the component configuration by eliminating separate fastening and connector components, while enhancing heat conductivity and dissipation.

Implementation Method 1

as a result of the insulating layer hardening on the rough surface of the heat dissipation member, the insulating layer penetrates the protrusions and recessions of the rough surface and is secured on top of the heat dissipation member

Methodology Applied

Scientific EffectHardening:

Implementation Method 2

a surface of the heat dissipation member that faces the circuit board is a rough surface having protrusions and recessions

Methodology Applied

Scientific EffectSurface roughening:

Implementation Method 3

enhancing heat conductivity and dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10038315B2Circuit assembly and electrical junction box

Publication Date: 2018.07.31 AUTONETWORKS TECH LTD

AI summary

Provided is a circuit assembly that enables suppression of a decrease in heat dissipation properties. A circuit assembly includes a circuit board having a conductive path, a heat dissipation member on which the circuit board is placed, and an insulating layer that is interposed between the circuit board and the heat dissipation member. A surface of the heat dissipation member that faces the circuit board is a rough surface having protrusions and recessions, and the circuit board and the heat dissipation member are fixed to each other by the insulating layer penetrating the protrusions and recessions of the rough surface.