Printed Circuit Aspects TRIZ Cases

This case uses balanced resin layers and prepreg waviness of Wa ≤ 6 μm for accurate laminates and lower package warpage variation.

A spring-loaded hold-down device compensates for component height gaps, improving thermal contact without stressing the circuit board.

This case shows how a heat bridge transfers heat from an electric element or lead to the board, reducing thermal stress and cost.

This case uses conductive bonding at the transmitting side and connectors at the receiving side to balance signal quality and assembly ease.

A shared LED module PCB footprint uses a breakaway auxiliary part to switch between frontside and through-board connectors.

This case aligns glass filaments in prepregs and cross-laminates layers to lower expansion without excess inorganic filler.

This case integrates a sealed printed heater, ESC circuit, and wiring in a dielectric substrate support for precise, uniform heating.

Silica-treated magnesium hydroxide resin helps limit ion migration and thermal expansion.

Direct fine redistribution bonding raises density while simplifying carrier fabrication.

Segmented COF wiring and protective spacing reduce short-circuit risk in flexible circuit boards.

A high-capacity metal fixing plate and 0.8–1.7 µm rays enable rapid paste baking without resin deformation or pattern peeling.

The microphone extends with the door handle for external sound detection, then retracts into the vehicle body for protection.

Wider through-holes and recessed vias increase PCB density while supporting reliable connections.

This PCB structure uses curved pad surfaces, via features, and metal filling to improve bonding and signal connectivity.

A holder fixes capacitor leads beside the board, reducing overlap while improving thickness, manufacturability, and impact resistance.

Specific diamine and biphenyl dianhydride ratios support low dielectric properties and adhesion on smoother metal foils.

An array substrate uses side-distributed FPC regions and isolation zones to reduce binding width and wiring interference.

Laser-modified substrate regions are etched into lenses, integrating the array with the display and simplifying assembly.

Predefined PCB shapes provide optical plane references, reducing operator dependence and avoiding time-consuming X-ray imaging.

Apertured platforms and coiled springs support varied induction coil layouts while limiting substrate bending and tensile stress.

An elastic textile support and self-gripping coil connections maintain fit and electrical continuity as trunk size changes.

This FPCB uses a 3.5–7.5 μm insulating layer to preserve isolation and reduce interference in thinner devices.