Semiconductor Storage Holder Structure for Thin, Stable Capacitor Leads
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Solution Overview
Problem
Existing semiconductor storage devices face challenges in reducing thickness and improving manufacturability due to the overlap of the board and capacitor components, which leads to increased thickness and vulnerability to vibrations and impacts.
Innovation Solution
The semiconductor storage device incorporates a holder that fixes the capacitor leads to the board, positioning the capacitor component out of the board's plane, reducing overlap and using holders to stabilize the leads, thereby minimizing thickness and enhancing manufacturability and resistance to vibrations and impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the capacitor component is positioned overlapping the board, then the device structure is simplified, but the thickness increases and vulnerability to vibrations and impacts worsens
Solution Approach 1:
The capacitor component is repositioned from a planar overlapping arrangement to a three-dimensional configuration where it extends in a direction substantially perpendicular to the board surface. This dimensional transition allows the capacitor leads to be positioned on opposite sides of the board, eliminating overlap while maintaining structural simplicity.
Solution Approach 2:
The capacitor component is divided into two separate components positioned on opposite sides of the board, with each component's lead passing through the board. This segmentation allows each component to be independently positioned and connected, reducing overall thickness while simplifying the mounting structure.
2Device complexity
If the capacitor component is positioned overlapping the board, then the device structure is simplified, but resistance to vibrations and impacts worsens
Solution Approach 1:
By transitioning from a planar overlapping structure to a three-dimensional perpendicular arrangement, the capacitor leads are positioned to extend in opposite directions from the board. This spatial distribution reduces stress concentration and improves resistance to vibrations and impacts while maintaining structural simplicity.
Solution Approach 2:
The capacitor leads are pre-positioned to extend in opposite directions from the board before final component attachment. This preliminary positioning ensures that the leads are optimally oriented to withstand vibrations and impacts, improving reliability before the device is put into service.
3Reliability
If the capacitor leads are held by holders, then bonding stability of leads to board is improved, but device complexity increases
Solution Approach 1:
The holder structure is merged with the board by forming the holder as an integrated part of the board or by closely coupling them. This integration reduces the number of separate components while maintaining the bonding stability function, as the holder and board act as a unified structure.
Solution Approach 2:
The holder is designed to serve multiple functions: it holds the capacitor lead, provides mechanical support, and facilitates bonding to the board. This multi-functionality reduces the need for additional components, maintaining bonding stability while minimizing device complexity.
Data Source
AI summary
A semiconductor storage device according to an embodiment includes a board, an electronic component, and a holder. The board has a first surface. The electronic component includes a component main body and a first lead. The component main body is at a position out of the board in a direction parallel to the first surface. The first lead protrudes from the component main body toward the board. The holder is on the board. The holder holds the first lead.