Printed Circuit Board Assembly with Spring-Loaded Heat-Sink Coupling
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Solution Overview
Problem
Existing circuit board assemblies face challenges in achieving effective thermal connection between components and heat sinks due to gaps and tolerances, which impair cooling efficiency, especially when multiple components are involved.
Innovation Solution
A spring-loaded hold-down device is used to press the circuit board against the heat sink, applying a spring force to minimize gaps and enhance thermal conductivity by ensuring consistent contact pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If screws are used to press the circuit board against the heat sink, then thermal connection is improved, but the circuit board layout is overly restricted and components cannot be selectively cooled
Solution Approach 1:
The hold-down device is divided into multiple independent hold-down elements, each capable of pressing a specific component against the heat sink. This segmentation allows selective cooling of individual components without restricting the overall circuit board layout, resolving the contradiction between thermal connection and layout flexibility.
Solution Approach 2:
The hold-down device uses elastic elements to provide dynamic, adjustable pressing forces to each hold-down element. This allows the system to adapt to different component heights and thermal requirements, enabling selective cooling while maintaining good thermal contact, thus resolving the layout restriction issue.
2Device complexity
If the number of screws is minimized, then circuit board layout freedom is improved, but gap compensation capability deteriorates
Solution Approach 1:
The hold-down device incorporates elastic elements that can deform to compensate for height tolerances and gap variations. By changing the physical state of the elastic elements (from relaxed to compressed), the system automatically adjusts to different gap dimensions without requiring multiple screws, thus maintaining manufacturing precision with minimal fasteners.
Solution Approach 2:
Each hold-down element is designed to independently compensate for local gap variations at its specific position on the circuit board. This localized gap compensation capability allows the system to handle different gap dimensions at different locations without increasing the overall number of screws, resolving the contradiction between layout freedom and gap control.
3Temperature
If higher pressure is applied between heat sink and component, then thermal conductivity is improved, but risk of damaging circuit board increases
Solution Approach 1:
The hold-down device applies pressing forces locally at specific component locations rather than distributing force across the entire circuit board. Each hold-down element targets a specific component that requires cooling, concentrating the pressure where it is most needed for thermal conductivity while minimizing the overall stress on the circuit board structure.
Solution Approach 2:
The elastic elements in the hold-down device provide a dynamic pressing force that automatically adjusts to the component and circuit board characteristics. The force increases as the component is pressed against the heat sink (improving thermal conductivity) but is naturally limited by the elastic element's deformation capacity, preventing excessive force that could damage the circuit board.
4Temperature
If multiple components are cooled simultaneously, then cooling effectiveness is improved, but gap variation complexity increases
Solution Approach 1:
The hold-down device is segmented into multiple independent hold-down elements, each responsible for pressing a specific component against the heat sink. This segmentation allows each element to independently compensate for gap variations at its location, enabling effective cooling of multiple components simultaneously despite different gap dimensions, without requiring a complex unified adjustment mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes gaps between components and heat sinks, improving thermal conductivity and cooling efficiency by distributing spring forces to avoid damage to the circuit board and maintain electrical insulation.
Implementation Method 1
a hold-down device (4), wherein the hold-down device (4) presses the circuit board (1) against the heat sink (3), wherein the hold-down device (4) is spring-loaded and exerts a spring force on the circuit board (1)
Implementation Method 2
cooling circuit board-based power electronics assemblies by pressing them against a heat sink
Implementation Method 3
The higher the pressure between the heat sink and the component to be cooled, the greater the thermal conductivity and therefore the cooling effect of the heat sink
Data Source
AI summary
A circuit board assembly includes: a circuit board having an upper side and a lower side; at least one electrical component arranged on the lower side of the circuit board; a heat sink; and a hold-down device, wherein the hold-down device presses the circuit board against the heat sink. Furthermore, the hold-down device is configured to be spring-loaded and exert a spring force on the circuit board.