Printed Heater Substrate Support for Multi-Zone Temperature Control
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Solution Overview
Problem
Conventional heater technologies for substrate supports in microelectronic device fabrication are inflexible, expensive, and struggle to provide precise temperature control and uniformity, especially with increasing complexity and demand for smaller, denser structures, while also being costly and difficult to modify or repair.
Innovation Solution
A substrate support with a printed heater sealed within a dielectric top plate, allowing for precise control over temperature and uniformity, featuring multiple zones and integrated circuits, fabricated using printing techniques that enable thinner, more complex designs and materials selection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal stage heater technology is used, then high temperatures can be reached, but the number of heating zones is limited and the structure is bulky
Solution Approach 1:
The heater is divided into multiple independent heating zones (e.g., first heating zone, second heating zone, third heating zone) that can be independently controlled. Each zone has its own heating element and can be activated separately to provide localized heating where needed, enabling complex temperature profiles across the substrate support surface.
Solution Approach 2:
Different regions of the substrate support receive different heating treatments through the segmented heating zones. Each zone can be optimized for specific local requirements, allowing certain areas to be heated to higher temperatures while other areas remain cooler, creating non-uniform temperature distributions tailored to specific processing needs.
2Temperature
If metal stage heater technology is used, then high temperatures can be reached, but the structure becomes bulky
Solution Approach 1:
The heating elements are implemented as thin printed circuits deposited directly onto the substrate support surface or integrated within thin dielectric layers. This replaces bulky traditional heater structures with thin-film technology, significantly reducing the overall volume while maintaining effective heating capability.
Solution Approach 2:
Traditional mechanical heating structures (metal stages, bulky elements) are replaced with printed circuit heater technology. The heating function is achieved through electrically conductive traces printed on the substrate support, eliminating the need for thick metal components and complex mechanical assemblies.
3Device complexity
If ceramic stage heater technology is used, then more heating zones can be achieved, but manufacturing cost increases significantly
Solution Approach 1:
The substrate support with integrated printed heater is designed as a cost-effective, potentially disposable component. The printed heater technology allows for low-cost fabrication compared to ceramic stage heaters, making the entire substrate support assembly economically viable for single-use or limited-life applications where replacement is more economical than repair or reconfiguration.
Solution Approach 2:
The manufacturing process parameters are changed from traditional ceramic sintering and metalworking to printed circuit fabrication techniques. This includes using screen printing, spray deposition, or other printing methods to apply conductive materials, followed by low-temperature firing or curing, dramatically reducing manufacturing costs while enabling complex multi-zone heating patterns.
4Ease of manufacture
If conventional heater technology is used, then manufacturing is simpler, but flexibility and adaptability are reduced
Solution Approach 1:
The heater design is made dynamic and reconfigurable through printed circuit technology. Heating zones can be independently controlled with variable power levels, and the printed nature of the heater allows for easy modification of heating patterns by changing the printed conductive trace configurations. This enables rapid adaptation to different substrate sizes, shapes, and heating requirements without requiring physical reconfiguration of the heater structure.
Solution Approach 2:
The substrate support with printed heater serves multiple functions: it provides mechanical support for the substrate, integrates multi-zone heating capability, and can incorporate temperature sensing elements. The printed heater structure can be customized for different applications, making a single platform technology applicable to various substrate processing scenarios with different temperature requirements.
5Ease of manufacture
If conventional heater technology is used, then initial manufacturing is easier, but modifications and repairs become difficult
Solution Approach 1:
The substrate support with integrated printed heater is designed as a unit that can be easily replaced as a complete assembly. When modifications or repairs are needed, the entire substrate support can be discarded and replaced with a new one, which is more economical and practical than attempting to repair or modify the integrated heater structure. The low cost of the printed heater technology makes this replacement strategy viable.
Solution Approach 2:
The heater is pre-configured during the substrate support manufacturing process with the exact heating pattern and zone configuration needed for the specific application. This preliminary customization eliminates the need for later modifications or repairs, as the heater is already optimized for its intended use when first fabricated.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The printed heater technology provides enhanced temperature control, uniformity, and flexibility, enabling complex designs with high precision, reduced material usage, and lower costs, while allowing for easier maintenance and faster prototyping.
Implementation Method 1
The printed heater includes a heater material printed on a first interior dielectric surface of the top plate
Implementation Method 2
a top plate including a dielectric material and an outer dielectric surface configured to support a substrate
Data Source
AI summary
A substrate support includes a top plate including a dielectric material and an outer dielectric surface configured to support a substrate, printed heater sealed within the top plate, and a printed electrostatic chuck (ESC) circuit sealed within the top plate. A printed wiring layer may also be sealed within the top plate. The printed heater includes a heater material printed on a first interior dielectric surface of the top plate. The printed ESC circuit includes an electrically conductive material printed on a second interior dielectric surface of the top plate. When included, the printed wiring layer may include wiring traces printed on a third interior dielectric surface of the top plate. A dielectric base layer with vias electrically coupling the wiring traces to the printed heater may be included between the printed wiring layer and the printed heater.