Metal-Clad Laminate Prepreg Control for Thickness and Warpage Uniformity
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Solution Overview
Problem
Existing methods struggle to achieve the required thickness accuracy and uniformity of metal-clad laminates and reduce warpage variation in semiconductor packages, particularly when using fiber base materials with a thickness of 40 μm or more.
Innovation Solution
A method involving the lamination of prepregs with specific thickness ratios and surface waviness conditions, where the prepreg contains a thermosetting resin composition and a fiber base material, with a thickness difference ratio of −9.0% to +9.0% and surface waviness of 6 μm or less, is used to produce metal-clad laminates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a fiber base material with a thickness of 40 μm or more is used to improve productivity and reduce manufacturing complexity, then the ease of manufacture increases, but the thickness accuracy and uniformity of dimensional change deteriorate
Solution Approach 1:
The invention applies preliminary action by controlling the surface waviness of the fiber base material before lamination. By specifying that the surface waviness Wa must be 6 μm or less, the patent prepares the base material in advance to ensure uniform resin distribution and consistent thickness after lamination, thereby achieving both ease of manufacture with thick materials and high thickness accuracy
Solution Approach 2:
The invention applies parameter changes by establishing specific quantitative parameters for the fiber base material: surface waviness Wa ≤ 6 μm and thickness t ≥ 40 μm. These parameter specifications transform the selection of thick fiber materials from a粗放 process into a controlled technical solution that simultaneously improves ease of manufacture and maintains thickness accuracy
2Device complexity
If a fiber base material with a thickness of 40 μm or more is used to simplify the structure and reduce layers, then the device complexity decreases, but the uniformity of dimensional change deteriorates
Solution Approach 1:
The invention applies preliminary action by pre-controlling the surface waviness of the fiber base material to Wa ≤ 6 μm before lamination. This preliminary control ensures that when thick fiber materials (t ≥ 40 μm) are used to reduce device complexity, the resin distributes uniformly throughout the material, thereby maintaining uniform dimensional change characteristics and stability of composition
Solution Approach 2:
The invention applies parameter changes by specifying critical parameters: surface waviness Wa ≤ 6 μm and fiber base material thickness t ≥ 40 μm. These parameter controls enable the use of fewer, thicker layers to reduce device complexity while ensuring uniform resin impregnation and consistent dimensional stability
3Shape
If mechanical pressurization is applied to improve surface smoothness, then the surface finish improves, but the thickness accuracy and dimensional uniformity remain insufficient
Solution Approach 1:
The invention applies preliminary action by controlling the surface waviness of the fiber base material to Wa ≤ 6 μm before lamination occurs. This preliminary surface control ensures uniform resin distribution from the beginning, eliminating the need for subsequent mechanical pressurization to improve surface smoothness, and simultaneously achieving both good surface finish and high thickness accuracy
Solution Approach 2:
The invention applies mechanics substitution by replacing the mechanical pressurization method (used in PTL 1) with a preliminary surface control approach. Instead of using mechanical force during or after lamination to improve smoothness, the patent controls the surface waviness parameter Wa ≤ 6 μm in advance, achieving both surface smoothness and thickness accuracy without relying on mechanical pressurization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method results in metal-clad laminates with improved thickness accuracy and reduced variation in dimensional change, enabling the production of printed wiring boards and semiconductor packages with enhanced uniformity and reduced warpage.
Implementation Method 1
a method for producing a metal-clad laminate, including: laminating a prepreg and a metal foil by heating and pressurizing
Data Source
AI summary
Provided are a method for producing a metal-clad laminate, including: laminating a prepreg and a metal foil by heating and pressurizing, in which the prepreg contains a thermosetting resin composition and a fiber base material having a thickness of 40 μm or more, the prepreg has a first resin layer which is provided on one surface of the fiber base material and contains the thermosetting resin composition; and a second resin layer which is provided on the other surface of the fiber base material and contains the thermosetting resin composition, in which when a thickness of the first resin layer is di and a thickness of the second resin layer is d2, a ratio R of a thickness difference represented by formula (1) is −9.0% to +9.0%, and surface waviness (Wa) of each of both surfaces of the prepreg is 6 μm or less, and a printed wiring board and a semiconductor package using the metal-clad laminate.