Flexible PCB Roughness Layer for Thin Electrical Isolation
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Solution Overview
Problem
The miniaturization of electronic devices poses challenges in reducing the thickness and size of components, necessitating a flexible printed circuit board (FPCB) with a non-conductive layer that can maintain electrical isolation while allowing for efficient signal transmission and reduced interference.
Innovation Solution
A flexible printed circuit board (FPCB) with a non-conductive layer thickness ranging from 3.5 to 7.5 micrometers, featuring conductive layers and shielding layers to ensure electrical isolation and reduce electromagnetic interference, allowing for thinner designs and increased battery capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the non-conductive layer is reduced to miniaturize the electronic device, then the overall size and thickness of the device is reduced, but the electrical isolation between conductive layers may be compromised
Solution Approach 1:
The patent employs a thin non-conductive layer (3.5-7.5 μm) as a flexible insulating film that maintains electrical isolation between conductive layers while enabling device miniaturization. This thin film approach resolves the contradiction by providing sufficient insulation in a reduced thickness format.
Solution Approach 2:
The patent optimizes the thickness parameter of the non-conductive layer to a specific range (3.5-7.5 μm) that balances electrical isolation requirements with miniaturization goals. By precisely controlling this parameter, the patent achieves both thin profile and reliable insulation.
2Length of moving object
If the non-conductive layer thickness is reduced to enable thinner FPCB design, then the flexibility and thinness of the circuit board is improved, but the space for internal components is reduced
Solution Approach 1:
The patent redistributes component placement across multiple dimensions and layers of the FPCB structure. By utilizing the lateral dimensions and multi-layer configuration, the patent compensates for the reduced thickness, maintaining adequate component space while achieving a thinner overall profile.
Solution Approach 2:
The thin non-conductive layer (3.5-7.5 μm) enables the FPCB to achieve a thinner profile while maintaining structural integrity. This thin film structure allows for flexible design configurations that can accommodate component placement requirements in a reduced thickness format.
3Length of moving object
If conductive layers are placed closer together to reduce FPCB thickness, then the overall thickness is reduced, but electromagnetic interference between layers increases
Solution Approach 1:
The non-conductive layer acts as an intermediary barrier between adjacent conductive layers, providing electrical isolation and reducing electromagnetic interference. This intermediate insulating layer enables closer spacing of conductive layers while maintaining signal integrity and minimizing interference.
Solution Approach 2:
The thin non-conductive film (3.5-7.5 μm) serves as an effective electromagnetic shield between conductive layers, allowing reduced layer spacing while preventing interference. The film's dielectric properties provide isolation despite the reduced thickness.
Data Source
AI summary
An electronic device includes a housing and a flexible printed circuit board (FPCB) transmitting a signal, the FPCB connecting electronic components disposed in the housing. The FPCB includes a non-conductive layer, a first conductive layer including a transmission line disposed on one side of the non-conductive layer configured to transmit the signal, and a second conductive layer disposed on another side opposite to one side of the non-conductive layer, wherein a thickness of the non-conductive layer is in a range of 3.5 um to 7.5 um and configured to electrically separate the transmission line and the second conductive layer.