Optical PCB Mounting with Geometric Plane References
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Solution Overview
Problem
Existing optical planar metrology methods for electrical components are operator-dependent and lack reliable means to quantify material removal during mechanical abrasion, making it difficult to accurately determine the cross-section plane location without time-consuming X-ray imaging.
Innovation Solution
A mounting apparatus featuring predefined geometric shapes, such as triangular arrays, on a circuit board to provide unique optical measurements of the cross-section plane, allowing rapid and accurate determination of the cross-section location through optical microscopy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If standard metallurgical cross-sectioning techniques with mechanical abrasion are used, then material removal and cross-section creation are effective, but operator dependency increases and measurement of cross-section plane location becomes unreliable
Solution Approach 1:
The patent replaces manual mechanical measurement methods with an automated optical measurement system. The system uses optical imaging to capture images of geometric shapes on the circuit board, then automatically calculates cross-section plane location through image processing and coordinate geometry, eliminating operator-dependent manual measurement and providing consistent, reliable results.
Solution Approach 2:
The patent implements a self-measuring system where the geometric shapes on the circuit board serve as built-in reference features. The optical measurement system automatically identifies these shapes, extracts their coordinates, and calculates the cross-section plane location without requiring external calibration or manual intervention, making the measurement process self-contained and repeatable.
2Measurement precision
If X-ray imaging is used to determine cross-section plane location, then accurate measurement is achieved, but measurement time increases significantly
Solution Approach 1:
The patent substitutes time-consuming X-ray imaging with rapid optical microscopy. The optical system captures images of geometric shapes on the circuit board surface, processes these images computationally to determine cross-section plane location, and delivers results in minutes rather than hours, achieving comparable accuracy through non-destructive optical methods.
Solution Approach 2:
The patent uses optical copying of the circuit board's geometric features instead of penetrating X-ray imaging. By capturing 2D optical images of known geometric shapes and mathematically determining their 3D spatial relationships, the system rapidly infers cross-section plane location without requiring physical penetration or complex tomographic reconstruction.
3Extent of automation
If geometric shapes are added to the circuit board for optical measurement, then measurement capability is improved, but device complexity increases
Solution Approach 1:
The patent makes the geometric shapes serve multiple functions: they act as alignment features during PCB fabrication, provide reference markers for optical measurement, and enable automated calculation of cross-section plane location. This multi-functionality justifies their inclusion, as they leverage existing manufacturing features rather than adding dedicated measurement components.
Solution Approach 2:
The geometric shapes serve as intermediary reference features that bridge the physical cross-section plane and the optical measurement system. These shapes are imaged by the optical system, and their known geometric properties mediate the calculation of cross-section location, translating physical measurements into meaningful spatial information without requiring direct measurement of the cross-section itself.
Data Source
AI summary
Disclosed are apparatus and methods for optical planar metrology of electrical components utilizing cross-sectioning techniques. A disclosed apparatus includes at least one predefined geometric shape or array composed of a material and disposed on a surface of the circuit board in proximity to an electrical component under test. The shape or array creates an optically measureable unique feature for each cross sectional plane created during the performance of optical planar metrology regardless of depth or overall planarity. The geometry of the shape or array ensures a unique cross-sectional profile for every plane and the material of the shape or array (e.g., copper or a similar material having equivalent optical properties) allows for optical visibility and differentiation from surrounding materials.