Circuit Board Air Gap Heat Blocking for Display Devices
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Solution Overview
Problem
Circuit boards generate heat that can damage external components, and existing solutions often require separate heat discharge members, increasing manufacturing costs and reducing portability in display devices.
Innovation Solution
A circuit board design featuring a base layer with a circuit layer and an air gap, where the air gap is filled with materials of low thermal conductivity, such as glass fibers or air, to block heat transfer, effectively preventing heat from reaching external components without the need for additional heat discharge members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If separate heat discharge members are added to block heat transfer, then heat blocking performance is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The heat blocking function is merged into the circuit board structure itself by creating an air gap within the circuit board layers. This integrates heat management into the existing circuit board without adding separate heat discharge members, thereby reducing device complexity while maintaining effective heat blocking performance.
Solution Approach 2:
An air gap is introduced as an intermediary layer within the circuit board structure. This air gap acts as a thermal barrier between heat-generating electronic elements and external components, effectively blocking heat transfer through the circuit board while being seamlessly integrated into the existing structure.
2Object-affected harmful factors
If separate heat discharge members are added to block heat transfer, then heat blocking performance is improved, but manufacturing cost increases
Solution Approach 1:
The heat blocking function is merged into the circuit board manufacturing process itself. By incorporating the air gap during circuit board fabrication, the need for separate heat discharge members is eliminated, thereby reducing manufacturing cost while maintaining effective heat blocking performance.
3Object-affected harmful factors
If the circuit board structure is modified to reduce heat transfer, then heat blocking performance is improved, but structural complexity increases
Solution Approach 1:
The circuit board is segmented into multiple layers with an air gap introduced between specific layers. This segmentation allows the heat blocking function to be integrated into the circuit board structure without significantly increasing overall structural complexity, as the air gap is created within the existing multi-layer configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the influence of heat on external components, improving the reliability and portability of display devices by integrating heat management within the circuit board, thereby reducing manufacturing costs.
Implementation Method 1
an air gap is defined in the circuit layer, a heat blocking part disposed in the air gap, and the heat blocking part has a thermal conductivity lower than a thermal conductivity of the circuit layer
Data Source
AI summary
A circuit board includes a base layer, a circuit layer disposed on the base layer, where an air gap is defined in the circuit layer, a heat blocking part disposed in the air gap, and an electronic element disposed on the circuit layer. The heat blocking part has a thermal conductivity lower than a thermal conductivity of the circuit layer.