Circuit Board Aperture Edge Geometry for Wiring Integrity
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Solution Overview
Problem
The existing circuit board structures for display panels, particularly in liquid crystal display devices, face challenges in maintaining the integrity and reliability of the circumference wiring connections between the active and peripheral areas, leading to potential disconnections and reduced manufacturing yield due to the steep edges and thin film thickness issues.
Innovation Solution
The implementation of a circuit board design featuring an insulating film with apertures that include concave and convex portions along the edge, allowing the circumference wiring to cross in a comb-like shape, which enhances the coverage area without expanding the aperture or wiring width, thereby reducing the risk of disconnection and improving manufacturing flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the aperture edge is formed with a steep slope to simplify manufacturing, then the manufacturing process is easier, but the film thickness becomes insufficient and disconnection occurs
Solution Approach 1:
The patent applies curvature to the aperture edge by forming a rounded profile instead of a steep straight slope. The edge includes a convex portion with a radius of curvature that is larger than the wiring width, allowing the wiring to safely cross without risking disconnection while maintaining manufacturability through standard photolithography processes.
2Reliability
If the aperture width is increased to provide better wiring coverage, then the wiring reliability improves, but the aperture area increases and manufacturing precision requirements worsen
Solution Approach 1:
Instead of increasing the aperture width in one dimension, the patent utilizes the edge geometry in another dimension by creating a convex portion with a specific curvature radius. This allows the wiring to achieve sufficient coverage area without expanding the overall aperture footprint, thereby maintaining manufacturing precision.
3Reliability
If the wiring width is increased to ensure sufficient coverage, then the connection reliability improves, but the aperture area must be larger and manufacturing complexity increases
Solution Approach 1:
The patent applies local quality by creating a convex portion at the aperture edge with a specific curvature radius that is larger than the wiring width. This localized geometric feature provides the necessary coverage area for reliable wiring connections without requiring the entire aperture or wiring structure to be larger, thus avoiding increased device complexity.
Data Source
AI summary
A circuit board includes an insulating film extending from an active area for displaying images to a peripheral area surrounding the active area. A circumference wiring is arranged in an aperture penetrating the insulating film and extending from the aperture to the active area on the insulating film so as to cross an edge of the aperture. The shape of the edge of the aperture which the circumference wiring crosses includes at least one concave portion and one convex portion, respectively.